Super Charge your Profiling using 6 Sigma Methodology!
The popular no nonsense profiling guide is back with this highly readable second addition.
New content such as Wave has been added along with a new format that focuses on each of the five steps of Six Sigma's DMAIC - Define, Measure, Analyze, Improve and Control
Additional contributors, such as Indium have offered insight in how to mitigate common reflow defects such as tombstoning, voiding and solder balling through profiling. Read more...
The 2011 Profiling Guide is available in the SMTA bookstore.
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Thermocouple Attachment Results are in!: The Rochester Institute of Technology under the guidanc...
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Save 15% in 15 minutes on your reflow's energy consumption: Topic: 15% electricity savings in 15 minutes
Da...
Stop Destroying PCBs in profiling your reflow process: 2009 Presentation at SMTA Long Island on how to use sof...
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In many situations, EMS...
Non Destructive BGA Profiling Test #1: I am currently investigating a non destructive method o...
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