2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.
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Podcast: Play in new window | Download (Duration: 4:00 — 26.9MB)
2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another. If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!
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Podcast: Play in new window | Download (Duration: 3:40 — 16.9MB)
2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process. After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.
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Podcast: Play in new window | Download (Duration: 3:00 — 13.6MB)
2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification. After you watch this 8 min video you will never take profiling for granted again!
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Podcast: Play in new window | Download (Duration: 8:10 — 39.9MB)
The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants. Due to its popularity an abridged 8 min version was created.
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Podcast: Play in new window | Download (Duration: 8:00 — 50.7MB)
Is your reflow oven throwing money away with a poor thermal management?
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Podcast: Play in new window | Download (6.4MB)
The following video shows you how to in the fewest steps possible in the least amount of time increase your reflow ovens throughput while maintaining an in-spec process. In this real life example, throughput was increased by 20% in 20 minutes time!
What do you do when you have temperature tolerant components on your PCB that require a different reflow profile?
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Podcast: Play in new window | Download (10.2MB)
The term process window is used to define your reflow spec in relation to your process. Vitor Barros of KIC Europe has used the following analogy to describe this relationship.
The following example describes when you have a reflow process that does not fit your product’s specification. You cannot change your process but you change change your spec (get a bigger picture frame).
The other extreme is where your spec is fixed and you need to modify your process (the picture canvass).
When both fit, you have what would be expected, a picture that fits perfectly to its frame.
I discuss with Vitor Barros of KIC Europe the Process Window. 
Podcast: Play in new window | Download (Duration: 2:29 — 2.3MB)
Jon Moore
Consultant at Moore Consulting and Manufacturer’s Representative, Ztech Services, Central US. (http://www.ztechservices.com/)
Jon has worked extensively in aerospace, military and automotive electronics manufacturing for 15 years. His most recent position was with TRW where he served 5 years as a Senior Manufacturing Engineer. Included with his hands on engineering experience Jon also taught 14 years as a certified soldering and rework instructor, with both the Department of Defense Category C certification and IPC J-Std certification. Jon has a B/S in business from State University of New York.
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Podcast: Play in new window | Download (Duration: 0:44 — 687.8KB)