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	<title>&#187; Characterization</title>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
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	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>&#187; Characterization</title>
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		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem: Title: Issues with BGA Components Near PCB Edges What issues are we likely to see when we place BGA components very close to [...]]]></description>
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		<title>Are you profiling bare boards or bricks?</title>
		<link>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/</link>
		<comments>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/#comments</comments>
		<pubDate>Sun, 11 Oct 2009 16:07:25 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=784</guid>
		<description><![CDATA[No one of course reflows bare boards, so why would you profile one?  For that same matter, no one sells bricks, so why do you put one through your reflow oven? Profiling Bare Boards: Today I came across CM doing exactly this.  They were processing networking boards.   They were  just too complex and expensive [...]]]></description>
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		<title>How to Maximize Reflow Ovens Throughput</title>
		<link>http://profilingguru.com/reflow/maximize-reflow-ovens-throughput/</link>
		<comments>http://profilingguru.com/reflow/maximize-reflow-ovens-throughput/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 21:09:19 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=555</guid>
		<description><![CDATA[The following video shows you how to in the fewest steps possible in the least amount of time increase your reflow ovens throughput while maintaining an in-spec process.   In this real life example, throughput was increased by 20% in 20 minutes time!]]></description>
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		<slash:comments>0</slash:comments>
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		<item>
		<title>Is there a standard calibration tool for the reflow process?</title>
		<link>http://profilingguru.com/reflow/standard-calibration-tool-for-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/standard-calibration-tool-for-reflow-process/#comments</comments>
		<pubDate>Thu, 28 May 2009 16:25:25 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=468</guid>
		<description><![CDATA[A question was posted on Circuitnet (May 18, 2009) asking if there is a standard test board that can be used for profiling/calibration of a reflow oven.   Answers were provided by profiling companies, oven and rework station manufacturers. The consensus from all groups was: There is no standard test board. There is no substitute to [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Characterize your Thermocouples</title>
		<link>http://profilingguru.com/reflow/characterization/characterize-your-thermocouples/</link>
		<comments>http://profilingguru.com/reflow/characterization/characterize-your-thermocouples/#comments</comments>
		<pubDate>Tue, 24 Feb 2009 03:37:30 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Featured]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=149</guid>
		<description><![CDATA[TCs are sensitive instruments of measurement. TCs are abused mainly because they are misunderstood. First, go out and purchase a set of TCs with the proper rating for your process with the least amount of variability.  Look at the thermocouples that you are using.  Organize the TCs according to observed temperature values by plugging them [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Characterize your Oven</title>
		<link>http://profilingguru.com/reflow/characterization/characterize-your-oven/</link>
		<comments>http://profilingguru.com/reflow/characterization/characterize-your-oven/#comments</comments>
		<pubDate>Tue, 24 Feb 2009 03:27:24 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=147</guid>
		<description><![CDATA[A well-defined calibration program according to ISO or NIST (National Institute of Standards and Technology) is recommended or, in most instances, required. Having the oven and the profiler calibrated ensures that the data collected by the profile, and in the interest of scientific methodology, is valid and repeatable. In addition to the calibration program, a [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Characterize your Facility</title>
		<link>http://profilingguru.com/reflow/characterization/characterize-your-facility/</link>
		<comments>http://profilingguru.com/reflow/characterization/characterize-your-facility/#comments</comments>
		<pubDate>Sat, 21 Feb 2009 14:24:49 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=83</guid>
		<description><![CDATA[Processes are often set-up on one continent and expected to be a carbon copy set-up on another continent. What do you think is going on when the end result doesn&#8217;t turn out this way? The answer: environmental factors. Play the detective and characterize your facility! What is Going On with your Exhaust? At first glance, [...]]]></description>
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		<slash:comments>0</slash:comments>
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