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	<title>Profilingguru &#187; Define</title>
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	<link>http://profilingguru.com</link>
	<description>Tips on how to Profile!</description>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>Profilingguru</title>
		<url>http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg</url>
		<link>http://profilingguru.com/category/reflow/define/</link>
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	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
	</itunes:category>
	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Stop Destroying PCBs in profiling your reflow process</title>
		<link>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/#comments</comments>
		<pubDate>Fri, 22 Jan 2010 16:40:09 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=980</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Stop_Destroying_PCBs.mp4" length="28174734" type="video/mp4" />
			<itunes:keywords>profiling,Reflow,reflow process,SMT</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>4:00</itunes:duration>
	</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem:
Title: Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
What [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Why are you replacing BGAs?</title>
		<link>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/</link>
		<comments>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/#comments</comments>
		<pubDate>Fri, 02 Oct 2009 16:57:02 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=782</guid>
		<description><![CDATA[There is a great post today in Circuitnet titled &#8220;BGA Replacement Limits,&#8221; that can be found under Circuitmart.  Panelists answer the following question:
How many times can a BGA component be replaced at the same location on the same PCB and retain reliability?
Mark McMeen of STI Electronics suggests that the answer may be as little as [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>BGA Profiling Webinar Recording</title>
		<link>http://profilingguru.com/reflow/bga-profiling-webinar-recording/</link>
		<comments>http://profilingguru.com/reflow/bga-profiling-webinar-recording/#comments</comments>
		<pubDate>Fri, 31 Jul 2009 17:25:42 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=570</guid>
		<description><![CDATA[The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/bga-profiling-webinar-recording/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/BGA_Profiling_Webinar2.m4v" length="53171671" type="video/x-m4v" />
			<itunes:keywords>BGA,BGA Profiling,cost-based tools,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards</itunes:keywords>
		<itunes:subtitle>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:00</itunes:duration>
	</item>
		<item>
		<title>Profiling BGA Webinar</title>
		<link>http://profilingguru.com/reflow/profiling-bga-webinar/</link>
		<comments>http://profilingguru.com/reflow/profiling-bga-webinar/#comments</comments>
		<pubDate>Wed, 24 Jun 2009 21:28:55 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[Thermal Process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=532</guid>
		<description><![CDATA[Profiling BGA Webinar Supplemental (July 1, 2009):
Component Specific Specs
We discussed the need to define BGA specs separate from other components that have different reflow requirements.   BGAs typically require more heat to reflow properly but typically there are many other &#8220;smaller&#8221; components that also populate a PCB that will overheat if you develop your process solely [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/profiling-bga-webinar/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Profiling guidelines for reflow of solder bump flip chip attach to organic and/or ceramic packages</title>
		<link>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/</link>
		<comments>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/#comments</comments>
		<pubDate>Wed, 24 Jun 2009 21:07:39 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=528</guid>
		<description><![CDATA[This post is in response to a suggested topic on this blog.  The following answer was provided by Brian J. Toleno, Ph.D., Director Technical Service at Henkel:
When profiling a flip-chip  to an organic substrate you typically want the delta T across the component to be as low as possible in order to minimize stresses [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Is Go-No-Go profiling good enough?</title>
		<link>http://profilingguru.com/reflow/is-go-no-go-profiling-good-enough/</link>
		<comments>http://profilingguru.com/reflow/is-go-no-go-profiling-good-enough/#comments</comments>
		<pubDate>Sat, 18 Apr 2009 13:43:37 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Go no go]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=416</guid>
		<description><![CDATA[What is go-no-go profiling? Well basically you get a pass/fail, green light/red light indication at the end of your profile letting you know whether you are in spec or not.
How often are most of us, when we get the &#8220;go&#8221; or green light at the end of the profile indicating that we finally got the [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/is-go-no-go-profiling-good-enough/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Maximize Throughput &#124; Profiling Software</title>
		<link>http://profilingguru.com/reflow/maximize-throughput-profiling-software/</link>
		<comments>http://profilingguru.com/reflow/maximize-throughput-profiling-software/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 11:40:37 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=344</guid>
		<description><![CDATA[Many of you will have an issue with &#8220;bottlenecks&#8221; in your process. This can happen at any point in the SMT Reflow process. Depending on the product that you are manufacturing, it is also likely that the &#8220;bottleneck&#8221; will jump from equipment set to equipment set.  For our purposes, let&#8217;s look at the reflow process [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/maximize-throughput-profiling-software/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Getting your Product Deeper in Spec &#124; Profiling Software</title>
		<link>http://profilingguru.com/reflow/getting-your-product-deeper-in-spec-profiling-software/</link>
		<comments>http://profilingguru.com/reflow/getting-your-product-deeper-in-spec-profiling-software/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 11:37:24 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=340</guid>
		<description><![CDATA[Q: What happens when defects occur when the thermal load on the oven increases?  Do you slow down production?  Do you change the oven set points by cranking up the heat to compensate for the increased load?
A: The answer is to establish a NEW profile that is deeper in spec., a profile that is able [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/getting-your-product-deeper-in-spec-profiling-software/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Reading your Profile via Profile software</title>
		<link>http://profilingguru.com/reflow/reading-your-profile-via-profile-software/</link>
		<comments>http://profilingguru.com/reflow/reading-your-profile-via-profile-software/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 00:38:14 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=322</guid>
		<description><![CDATA[Let&#8217;s take a close look at the profiling graph and the specifications used to create the graph.
The Solder Paste Library of your profiling software provides several choices:
Maximum Slope Between Temperatures
Maximum Rising Slope (Ramp Rate)
Maximum Falling Slope (Cooling Rate)
Preheat
Soak
Time Above Liquidus (TAL)
Reflow
Peak
Maximum Exit Temperature
For some inputs, such as slope, preheat, soak and TAL you can define [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reading-your-profile-via-profile-software/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
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