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	<title>Profilingguru &#187; Reflow</title>
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	<link>http://profilingguru.com</link>
	<description>Tips on how to Profile!</description>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>Profilingguru</title>
		<url>http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg</url>
		<link>http://profilingguru.com/category/reflow/</link>
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	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Spot Checking your Reflow Oven &#8211; Part I</title>
		<link>http://profilingguru.com/reflow/spot-checking-your-reflow-oven-part-i/</link>
		<comments>http://profilingguru.com/reflow/spot-checking-your-reflow-oven-part-i/#comments</comments>
		<pubDate>Wed, 30 Jun 2010 13:56:05 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=991</guid>
		<description><![CDATA[Reflow ovens have come a long way, they are much more stable, better controlled, well built and less expensive.   Nevertheless, the need for profiling has not been eliminated, since after all the reflow oven is just a means to an end.  You still need to dial in your oven set points to achieve a desired [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/spot-checking-your-reflow-oven-part-i/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Stop Destroying PCBs in profiling your reflow process</title>
		<link>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/#comments</comments>
		<pubDate>Fri, 22 Jan 2010 16:40:09 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=980</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Stop_Destroying_PCBs.mp4" length="28174734" type="video/mp4" />
			<itunes:keywords>profiling,Reflow,reflow process,SMT</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>4:00</itunes:duration>
	</item>
		<item>
		<title>Reflow Oven Profiling Automation</title>
		<link>http://profilingguru.com/reflow/automation/reflow-oven-profiling-automation/</link>
		<comments>http://profilingguru.com/reflow/automation/reflow-oven-profiling-automation/#comments</comments>
		<pubDate>Tue, 05 Jan 2010 16:28:26 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[automatic profiling]]></category>
		<category><![CDATA[reflow oven automation]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=962</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to automate your reflow profiling processes, with added benefits such as traceability and process control.
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/automation/reflow-oven-profiling-automation/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Automation.m4v" length="18700531" type="video/x-m4v" />
			<itunes:keywords>automatic profiling,reflow oven automation,thermal profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to automate your reflow profiling processes, with added benefits such as traceability and process control. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to automate your reflow profiling processes, with added benefits such as traceability and process control.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
	</item>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 11:11:30 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Reducing Reflow Product Changeover Time</title>
		<link>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/</link>
		<comments>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/#comments</comments>
		<pubDate>Sat, 07 Nov 2009 23:06:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=931</guid>
		<description><![CDATA[2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!
To view the complete video series (click here).
To subscribe to my Podcast for [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Product_Changeover.m4v" length="17698353" type="video/x-m4v" />
			<itunes:keywords>AOI,BGA,BGA Profiling,ceramic packages,cost-based tools,electronics manufacturing services,energy efficiency,flip chip,maximize throughput,Process monitoring,Process Window,profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:40</itunes:duration>
	</item>
		<item>
		<title>Increasing Reflow Oven Throughput</title>
		<link>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/</link>
		<comments>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/#comments</comments>
		<pubDate>Fri, 06 Nov 2009 11:53:21 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=902</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.
To view the complete video series (click [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Increased_Throughput.m4v" length="14288595" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a parti...</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).

 </itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:00</itunes:duration>
	</item>
		<item>
		<title>Getting your Profiler Deeper within Specification</title>
		<link>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/</link>
		<comments>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/#comments</comments>
		<pubDate>Wed, 04 Nov 2009 17:22:36 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=865</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
 
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Deeper_in_Spec.m4v" length="41867739" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards,SMT Reflow</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! - To view the complete video series (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).

 </itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:10</itunes:duration>
	</item>
		<item>
		<title>What to do with Zig-Zagging TC Readings?</title>
		<link>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/</link>
		<comments>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 17:02:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=846</guid>
		<description><![CDATA[What&#8217;s wrong with this picture?

Well if you have ever used Kapton tape to attach a thermocouple, you have certainly seen your share of profiles like this!
So what, it is a perfectly good profile, right?  Yes, but no.  I had a customer who was using KIC&#8217;s Navigation (auto prediction) to help create a better &#8220;deep in-spec&#8221; [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem:
Title: Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
What [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Thermocouple Attachment Results are in!</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/#comments</comments>
		<pubDate>Mon, 12 Oct 2009 14:50:54 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=807</guid>
		<description><![CDATA[The Rochester Institute of Technology under the guidance of Dr. S. Manian Ramkumar Ph.D. just conducted (October 2009) the most comprehensive study to date on thermocouple attachment methods.  Part I of II was to determine the most accurate and reliable method of thermocouple attachment.  Part II that has yet to be released is to determine [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
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