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	<title>Profilingguru &#187; Improve</title>
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	<link>http://profilingguru.com</link>
	<description>Tips on how to Profile!</description>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>Profilingguru</title>
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		<itunes:category text="Training" />
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		<item>
		<title>Stop Destroying PCBs in profiling your reflow process</title>
		<link>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/#comments</comments>
		<pubDate>Fri, 22 Jan 2010 16:40:09 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=980</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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			<itunes:keywords>profiling,Reflow,reflow process,SMT</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>4:00</itunes:duration>
	</item>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 11:11:30 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Reducing Reflow Product Changeover Time</title>
		<link>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/</link>
		<comments>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/#comments</comments>
		<pubDate>Sat, 07 Nov 2009 23:06:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=931</guid>
		<description><![CDATA[2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!
To view the complete video series (click here).
To subscribe to my Podcast for [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Product_Changeover.m4v" length="17698353" type="video/x-m4v" />
			<itunes:keywords>AOI,BGA,BGA Profiling,ceramic packages,cost-based tools,electronics manufacturing services,energy efficiency,flip chip,maximize throughput,Process monitoring,Process Window,profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:40</itunes:duration>
	</item>
		<item>
		<title>Increasing Reflow Oven Throughput</title>
		<link>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/</link>
		<comments>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/#comments</comments>
		<pubDate>Fri, 06 Nov 2009 11:53:21 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=902</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.
To view the complete video series (click [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Increased_Throughput.m4v" length="14288595" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a parti...</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).

 </itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:00</itunes:duration>
	</item>
		<item>
		<title>Getting your Profiler Deeper within Specification</title>
		<link>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/</link>
		<comments>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/#comments</comments>
		<pubDate>Wed, 04 Nov 2009 17:22:36 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=865</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
 
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Deeper_in_Spec.m4v" length="41867739" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards,SMT Reflow</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! - To view the complete video series (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).

 </itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:10</itunes:duration>
	</item>
		<item>
		<title>What to do with Zig-Zagging TC Readings?</title>
		<link>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/</link>
		<comments>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 17:02:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=846</guid>
		<description><![CDATA[What&#8217;s wrong with this picture?

Well if you have ever used Kapton tape to attach a thermocouple, you have certainly seen your share of profiles like this!
So what, it is a perfectly good profile, right?  Yes, but no.  I had a customer who was using KIC&#8217;s Navigation (auto prediction) to help create a better &#8220;deep in-spec&#8221; [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem:
Title: Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
What [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Four Ways to Reduce your Reflow Oven&#8217;s Power Consumption</title>
		<link>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/</link>
		<comments>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/#comments</comments>
		<pubDate>Fri, 25 Sep 2009 16:22:33 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=715</guid>
		<description><![CDATA[What are you paying annually in electricity to run your reflow oven?  Not taking into account indirect costs, surcharges, taxes and added wear and tear of running your oven hotter and harder, you might be paying anywhere from $6-8K per line.   This number is based off a study conducted at Flextronics Poland, where they pay [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Running lead free and eutectic PCBs simultaneously on the same reflow oven</title>
		<link>http://profilingguru.com/reflow/improve/running-lead-free-and-eutectic-pcbs-simultaneously-on-the-same-reflow-oven/</link>
		<comments>http://profilingguru.com/reflow/improve/running-lead-free-and-eutectic-pcbs-simultaneously-on-the-same-reflow-oven/#comments</comments>
		<pubDate>Thu, 17 Sep 2009 15:29:29 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=699</guid>
		<description><![CDATA[Surface Mount Technology ran a piece titled Parallel Processes: Simultaneous Lead and Lead-free Soldering with a Single Reflow System written by Hans Bell of Rehm Thermal Systems GmbH.  Hans details a study where by controlling conveyor speed of each lane of a dual-lane system, it is possible to run both a lead and lead free [...]]]></description>
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		<title>No Waste: Beyond PCBs in Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/no-waste-beyond-pcbs-in-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/no-waste-beyond-pcbs-in-reflow-profiling/#comments</comments>
		<pubDate>Wed, 16 Sep 2009 22:49:45 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=692</guid>
		<description><![CDATA[Article is from SMT Magazine
In many situations, EMS providers cannot waste a PCB for thermal profiling. Some ovens are equipped with profiling tools to generate an accurate reflow recipe without thermal profiling. This saves time, labor, money, and materials, but there are limitations.
By Brian O&#8217;Leary, KIC
There is a right way and a wrong way to [...]]]></description>
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