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	<title>Profilingguru &#187; Types of Profiles</title>
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	<link>http://profilingguru.com</link>
	<description>Tips on how to Profile!</description>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>Profilingguru</title>
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	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
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		<itunes:category text="Training" />
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		<item>
		<title>What is a baseline profile?</title>
		<link>http://profilingguru.com/reflow/what-is-a-baseline-profile/</link>
		<comments>http://profilingguru.com/reflow/what-is-a-baseline-profile/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 12:06:15 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=361</guid>
		<description><![CDATA[Baseline profiles are used purely for set-up purposes. They are manually-fed into the reflow oven and are run in tandem with a monitoring system in order to create what is called a &#8220;virtual profile.&#8221;   Baseline profiles, thus, become the standard by which all automated profiles are compared.  If there are any deviations between the baseline [...]]]></description>
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		<slash:comments>2</slash:comments>
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		<item>
		<title>Oven vs. Process Monitoring, what’s the Difference?</title>
		<link>http://profilingguru.com/reflow/oven-vs-process-monitoring/</link>
		<comments>http://profilingguru.com/reflow/oven-vs-process-monitoring/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 12:02:09 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=357</guid>
		<description><![CDATA[Thermal monitoring systems can often help you troubleshoot your oven by getting to the root causes of many process-related problems. Information on oven and process changes can be investigated. There is a very important distinction to be made between oven monitoring and process monitoring.  Changes or no noticeable changes to your &#8220;oven&#8221; may or may [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Getting your Product Deeper in Spec &#124; Profiling Software</title>
		<link>http://profilingguru.com/reflow/getting-your-product-deeper-in-spec-profiling-software/</link>
		<comments>http://profilingguru.com/reflow/getting-your-product-deeper-in-spec-profiling-software/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 11:37:24 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=340</guid>
		<description><![CDATA[Q: What happens when defects occur when the thermal load on the oven increases?  Do you slow down production?  Do you change the oven set points by cranking up the heat to compensate for the increased load?
A: The answer is to establish a NEW profile that is deeper in spec., a profile that is able [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>How to Establish the “First” Profile for a New Product</title>
		<link>http://profilingguru.com/reflow/how-to-establish-the-%e2%80%9cfirst%e2%80%9d-profile-for-a-new-product/</link>
		<comments>http://profilingguru.com/reflow/how-to-establish-the-%e2%80%9cfirst%e2%80%9d-profile-for-a-new-product/#comments</comments>
		<pubDate>Sat, 28 Mar 2009 00:14:22 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Featured]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=313</guid>
		<description><![CDATA[Clever profiling software will calculate a profile based on the size of your PCB or from dummy profiles already loaded on the Reflow oven. It is part of the prediction utility of your profiling software or pre-installed on your reflow oven. This software mines prior work, including your own profiles developed from other products or, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/how-to-establish-the-%e2%80%9cfirst%e2%80%9d-profile-for-a-new-product/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Configuration of the Graph &#124; Reflow Process</title>
		<link>http://profilingguru.com/reflow/configuration-of-the-graph-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/configuration-of-the-graph-reflow-process/#comments</comments>
		<pubDate>Sat, 14 Mar 2009 16:34:16 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=280</guid>
		<description><![CDATA[The profile graph will tell you whether or not your process is within spec and that your reflow oven is creating the correct profile, nothing more. Double check your set-up again before diving into your profile. The information from the graph must be &#8220;true.&#8221;
There are dozens of software packages that mostly render the same information, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/configuration-of-the-graph-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Low-Long –Spike</title>
		<link>http://profilingguru.com/reflow/types-of-profiles/low-long-%e2%80%93spike/</link>
		<comments>http://profilingguru.com/reflow/types-of-profiles/low-long-%e2%80%93spike/#comments</comments>
		<pubDate>Sat, 21 Feb 2009 12:35:55 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=40</guid>
		<description><![CDATA[Description of a Low-Long-Spike profile for reflow.]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/types-of-profiles/low-long-%e2%80%93spike/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Ramp to Spike</title>
		<link>http://profilingguru.com/reflow/types-of-profiles/ramp-to-spike/</link>
		<comments>http://profilingguru.com/reflow/types-of-profiles/ramp-to-spike/#comments</comments>
		<pubDate>Sat, 21 Feb 2009 12:32:31 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=36</guid>
		<description><![CDATA[Description of a Ramp to Spike profile for reflow.]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/types-of-profiles/ramp-to-spike/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Ramp Soak Spike</title>
		<link>http://profilingguru.com/reflow/types-of-profiles/ramp-soak-spike/</link>
		<comments>http://profilingguru.com/reflow/types-of-profiles/ramp-soak-spike/#comments</comments>
		<pubDate>Sat, 21 Feb 2009 11:58:29 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Types of Profiles]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=28</guid>
		<description><![CDATA[Description of a Ramp Soak Spike profile for reflow.]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/types-of-profiles/ramp-soak-spike/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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