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	<title>Profilingguru &#187; TC&#8217;s</title>
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	<link>http://profilingguru.com</link>
	<description>Tips on how to Profile!</description>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>Profilingguru</title>
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		<link>http://profilingguru.com/category/tcs/</link>
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		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Stop Destroying PCBs in profiling your reflow process</title>
		<link>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/#comments</comments>
		<pubDate>Fri, 22 Jan 2010 16:40:09 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=980</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.
To view the complete video series (click here).
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Stop_Destroying_PCBs.mp4" length="28174734" type="video/mp4" />
			<itunes:keywords>profiling,Reflow,reflow process,SMT</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>4:00</itunes:duration>
	</item>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Tue, 17 Nov 2009 11:11:30 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>What to do with Zig-Zagging TC Readings?</title>
		<link>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/</link>
		<comments>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 17:02:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=846</guid>
		<description><![CDATA[What&#8217;s wrong with this picture?

Well if you have ever used Kapton tape to attach a thermocouple, you have certainly seen your share of profiles like this!
So what, it is a perfectly good profile, right?  Yes, but no.  I had a customer who was using KIC&#8217;s Navigation (auto prediction) to help create a better &#8220;deep in-spec&#8221; [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem:
Title: Issues with BGA Components Near PCB Edges
What issues are we likely to see when we place BGA components very close to PCB edges?
What [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Thermocouple Attachment Results are in!</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/#comments</comments>
		<pubDate>Mon, 12 Oct 2009 14:50:54 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=807</guid>
		<description><![CDATA[The Rochester Institute of Technology under the guidance of Dr. S. Manian Ramkumar Ph.D. just conducted (October 2009) the most comprehensive study to date on thermocouple attachment methods.  Part I of II was to determine the most accurate and reliable method of thermocouple attachment.  Part II that has yet to be released is to determine [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
		</item>
		<item>
		<title>Why are you replacing BGAs?</title>
		<link>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/</link>
		<comments>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/#comments</comments>
		<pubDate>Fri, 02 Oct 2009 16:57:02 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=782</guid>
		<description><![CDATA[There is a great post today in Circuitnet titled &#8220;BGA Replacement Limits,&#8221; that can be found under Circuitmart.  Panelists answer the following question:
How many times can a BGA component be replaced at the same location on the same PCB and retain reliability?
Mark McMeen of STI Electronics suggests that the answer may be as little as [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Thermocouple Attachment Discussion</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-discussion/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-discussion/#comments</comments>
		<pubDate>Fri, 18 Sep 2009 14:16:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=704</guid>
		<description><![CDATA[Phil Zarrow and Jim Hall of ITM Consulting have a very good piece on TC attachment on Board Talk hosted by Circuitmart.com.
In their first session, they talk about permanent TC attachment, such as high temp solder and epoxy (click here for a link to their recording).  Yours truly left a comment with the boys:
We are [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-discussion/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Non Destructive BGA Profiling Test #1</title>
		<link>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/</link>
		<comments>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/#comments</comments>
		<pubDate>Tue, 01 Sep 2009 11:49:40 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=429</guid>
		<description><![CDATA[I am currently investigating a non destructive method of BGA profiling that is reliable.  Here are the results of my first test.
Set Up:
Four thermocouples are attached to the same BGA (TOP, SIDE, INSIDE and BOTTOM surface), as pictured below.  Conductive aluminium double sided tape is used along with Kapton.  A KIC Explorer is the profiler.
To [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/feed/</wfw:commentRss>
		<slash:comments>2</slash:comments>
		</item>
		<item>
		<title>BGA Profiling Webinar Recording</title>
		<link>http://profilingguru.com/reflow/bga-profiling-webinar-recording/</link>
		<comments>http://profilingguru.com/reflow/bga-profiling-webinar-recording/#comments</comments>
		<pubDate>Fri, 31 Jul 2009 17:25:42 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=570</guid>
		<description><![CDATA[The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.
To subscribe to my Podcast for iTunes (click here).
]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/bga-profiling-webinar-recording/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/BGA_Profiling_Webinar2.m4v" length="53171671" type="video/x-m4v" />
			<itunes:keywords>BGA,BGA Profiling,cost-based tools,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards</itunes:keywords>
		<itunes:subtitle>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:00</itunes:duration>
	</item>
		<item>
		<title>Profiling BGA Webinar</title>
		<link>http://profilingguru.com/reflow/profiling-bga-webinar/</link>
		<comments>http://profilingguru.com/reflow/profiling-bga-webinar/#comments</comments>
		<pubDate>Wed, 24 Jun 2009 21:28:55 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[Thermal Process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=532</guid>
		<description><![CDATA[Profiling BGA Webinar Supplemental (July 1, 2009):
Component Specific Specs
We discussed the need to define BGA specs separate from other components that have different reflow requirements.   BGAs typically require more heat to reflow properly but typically there are many other &#8220;smaller&#8221; components that also populate a PCB that will overheat if you develop your process solely [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/profiling-bga-webinar/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
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