Soldering and Profiling Discussion Panel at Apex 2009

Panelists at APEX discuss misconceptions about the reflow process and how to Minimize Delta Ts, etc.

Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling at APEX 2009. Panelists include Keith Howell of Nihon Superior, Fred Dimock of BTU and Michael Limberg from KIC.

Much of the 30 min discussion hits upon how customers often confuse an oven’s recipe with a PCB’s profile/recipe.  Factors such as density, delta Ts, belt speed, different components and extraction are used as examples as to why the oven’s set points don’t always match the temperatures on the PCB. All panelists agree that a fair amount of customers do not understand these important concepts.

Fred Dimock of BTU cites an interesting study he conducted to highlight the difference mass has on the peak temperatures a board experiences without changing the oven set points. The example he gives is a 100gram board that achieves a 231 C peak when compared with a 230gram board only reaching a 225C peak with everything else being equal. Panelists agree that customers often expect to see the same profile at a given oven set up, when obviously factors such as mass play such a critical role!

All panelists talked at length about how to minimize delta Ts as an important factor in producing quality PCBs.  The PCB design and layout of components was discussed by Keith and Mike.

Fred cited a study that higher convection rates also yield a lower delta T, taking into account the need to maintain a stable environment early on in the reflow process before components have had a chance to take hold. Starting at low convection allowing the flux to become tacky (thus keeping components in position) and eventually raising convection in the peak zone can minimize large deltas.

Fred also shared a profiling trick with Ramp Soak Spike profiles he likes to use when trying to minimize the delta Ts at peak.   In RSS profiles, one would run as close to the edge of the top of the spec of soak and get as high as you can in temp early before you hit the spike, but you need a quality profiler and good ThermoCouple attachment to pull this off, Fred added.

The session also covered briefly upon topics such as:

  • Vapor Phase profiling: Keith & Mike
  • Nihon’s SN100C paste: Keith
  • How to Profile Expensive Components: Mike
  • Importance of Cool Down and considerations, such as the roll of large BGAs: Fred and Keith

To watch a video of the session, click here:  http://blip.tv/file/1969267/

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Thermocoupling BGA

Perhaps the most challenging components to thermocouple are BGAs, since the area of reflow is hidden underneath the component. The most accurate methodologies are destructive.  The simplest way to thermocouple a BGA may be to drill a hole on the underside of the BGA and thread the TC bead into the drill-out hole that allows access to the target area without having to remove and re-attach the BGA.

Another method is to use a very thin gauge TC wire (40 AWG) and separate the two dissimilar wires, as shown below.  Then attach the TC and place the BGA on top of the TCs.  Again, the point of this exercise is to achieve an accurate “direct” reading.

tcbga1

Special thanks to Scott Nelson at Harris Corporation for providing this example.

A non-destructive method for thermocoupling BGAs is to simply mount the TC on top of the BGA and, perhaps, to the underside of the PCB directly below the BGA, and develop an offset. There is no right or wrong answer; much depends on your production tolerances and a whole host of other variables that have been discussed in this guide. The point is that only you know your process and limitations with respect to product and tools.

Note: This is an area of particular interest to me since it is a concern that just about everyone has an opinion on and no true right or wrong way has been developed.  Stay tuned more to come soon.

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What is a baseline profile?

Baseline profiles are used purely for set-up purposes. They are manually-fed into the reflow oven and are run in tandem with a monitoring system in order to create what is called a “virtual profile.”   Baseline profiles, thus, become the standard by which all automated profiles are compared.  If there are any deviations between the baseline profile and the automated profile, this information is recorded and can trigger alarms and stop production temporarily. Baseline profiles also have the added advantage of becoming a true “gold standard” for all of your profiles, since the same profiling board is not being used repeatedly or subject to degradation of the PCB, thermocouples or operator error.

The set-up of a baseline profile is performed by running a normal profile, per recipe.  Meanwhile, 1-2 fixed mounted probes (typical an array of 15-30 thermocouples) collect their own set of data as the PCB runs the length of the Reflow oven with a profiler. This information is then compared and processed by the monitoring system.  This array of internally-mounted thermocouples is able to reconstruct a virtual model of a profile. When a production board enters, without the profiler, the same TC readings that were present when your oven was profiled are now re-mapped onto each and every PCB.

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Starting your Data Run

Profiling is no different than running an experiment, which relies on your ability to create reproducible profiles with your inputs, with each data sampling remaining constant.  If you start your data run on the bench and manually load the profile into the Reflow oven, it is unlikely that you will get the exact start and stop point for each run. Take care to start and stop in the same physical location each time.

profilerTo ensure repeatability, profiling software should, at a minimum, include both automatic distance measurements and temperature triggers, rather than manual start and stop points. The air thermocouple feature of the KIC system does away with the need to manually trigger (on/off) of the profile run, eliminating a step that can potentially invalidate your profile run.

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Thermocouple Attachment

There are several methods to attach thermocouples to PCBs, some better than others. When attaching TCs, they should be strategically attached to areas that are dissimilar in terms of mass, location and known trouble spots. They should also be isolated from air currents. Lastly, the placement of several TCs should range from populated to less populated areas of the PCB for the best sampling conditions.

Several methods of attachment have been used over the years. These include: epoxy, high temperature solder, Kapton®  and aluminum tape. I have observed all four methods in the field with various levels of success for each method.

Epoxy

I find that epoxy is very good at securing TC conductors to the profile board to keep them from becoming entangled in the oven during profiling.  Epoxies come in both insulator and conductor formulations, so you need to check the specs, otherwise an insulator can play a negative role in the collection of profile data.  The ability to apply this adhesive in similar quantities and thickness is very difficult and even harder to measure in quantitative terms. This, of course, decreases reproducibility.

If you insist on epoxy, it is always wise to check the website of the epoxy that you are using to review the properties and the specifications of the epoxy.  Epoxy will function within a wide range of temperature tolerances.

High Temperature Solder

The properties of solder used for TC attachment is quite different from that of electrically connective solder. Of obvious consideration, is the melting point of the attachment solder, which must be higher than the melting point of the reflow solder paste.

Also, keep in mind that the flux used for attaching high temperature solder must not interfere with your reflow process. This is especially important if the profile board is used as a finished product!

High temperature solder is not the best choice to use for TC attachment for a couple of reasons. First, it has the same pitfalls as epoxy, in that the quantity of solder needed to adhere the TC to a substrate varies from location to location.  Secondly, solder is conductive; and therefore, it has been known to short- circuit thermocouples.  Keep in mind that a thermocouple works when two dissimilar metals are apart from one another and only joined at the bead.  Take a minute to look at the welded end of a thermocouple.

Generally, there is a short length of conductor that is exposed to the temperature gradient. Together, this exposed area, along with the physical weld produce an EMF(Electromotive Force). It is essential that the conductors and the weld are in a homogenous environment within the temperature gradient. It would be very difficult to simulate this environment with solder for each thermocouple on a PCB since several thermocouples would be required. The same is true for epoxy.

Kapton®

Kapton® tape is one of the most widely used tapes and methods for TC and TC conductor attachment. There are several sources for Kapton® and most properties are the same. Some advantages are: ease of use, cost and non-permanence.

Although most tapes are the basically the same, similar tapes and specifications can be different enough to affect attachment. Also, when several layers are applied, each layer will have an additive effect on the insulation and can negatively impact your profile. It is best to apply a thin layer. Another important disadvantage of this tape is that the PCB has to be very clean and smooth to achieve an airtight cover over the thermocouple weld and conductors. For this reason, it is not my first choice for TC attachment.

Aluminum Tape

There are several sources of aluminum tape with various thicknesses and density. I prefer to have a less dense and thinner aluminum tape to minimize the effects of the tape directly on the TC weld. Heavier aluminum tape can defuse the heat transfer through the tape and act as an insulator. Keep in mind that you are looking for the method of TC attachment that has the least effect thermally but with maximum ability to adhere the TC to the contact point of data collection.

Low density aluminum tape allows for heat transfer to the EMF-producing area of the TC. The thermal conductivity of the aluminum tape allows for even conduction when the thickness of the tape is fairly consistent in the EMF-producing area of the thermocouple. Additionally, aluminum tape is not permanent, which is good because the board you are profiling can actually be sold, but you might need to reapply tape to the same profiling board after a couple of profiles.

Aluminum Tape Used Along with Kapton®

Now for a dynamite combination: Kapton® and Low Density Aluminum tape. Used together, they produce the least invasive methods of attachment.  Using Kapton® tape to hold the aluminum tape in place and secure the thermocouple conductors is an effective use for Kapton® tape. A common method of TC attachment is called Window Paning (see figure 7-6).  Use Kapton® around the aluminum tape as an anchor, while keeping only the area of attachment in contact with the aluminum tape. This gives your thermocoupled board many more uses before it needs to be re-taped.

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TC Prep

TC Prep

TCs are two dissimilar metals joined by a welded bead. In order for a TC to read the temperature at any given point, the welded bead must come in direct contact with whatever you are measuring. The two dissimilar wires must remain separated and only joined at the bead; otherwise, your reading is no longer at the welded bead but wherever these two metals first make contact, rendering the reading invalid.

I have seen plenty of twisted TCs and TCs cut to length!

twistedscissors

You will not get an accurate reading if your TC loses contact with the attachment material. The TC welded bead has to remain in direct contact with your component. A zigzagging TC reading on your profile graph is a sign of a loosely attached TC.  This is why I am not a fan of TC probes since they can jump and bounce on the board.  Twisting your TC, will also give you a false reading, since your TC will measure from the first twist or point of contact.  I’ve seen plenty of TCs sticking out of solder or epoxy where this point of first contact is an inch off the PCB. In this case, you are measuring air!

Take the time-every time– to prep your TCs so that they remain apart and a welded bead remains in direct contact with your component. I use a hand pick and apply upward pressure toward the bead to separate the two wires. It will not break since it is a welded bead and should be solidly attached.

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