BGA Profiling Webinar Recording
Posted by Brian O'Leary on July 31, 2009 · Leave a Comment
The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants. Due to its popularity an abridged 8 min version was created.
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Podcast: Play in new window
| Download (Duration: 8:00 — 50.7MB)
Filed under Automation, Define, Improve, Measure, Podcasts, Reflow, TC's · Tagged with BGA, BGA Profiling, cost-based tools, defect rates, efficiency, electronics manufacturing services, profiling, Reflow, reflow oven, reflow process, reflow profiling, SMT and standards, soldering, SPI, surface mount technology, thermal process, thermal profiling
About Brian O'Leary
Post Author: Brian O'Leary - Americas Sales Manager for KIC
