Comments on: Non Destructive BGA Profiling Test #1 http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/ Tue, 17 Nov 2009 18:21:17 +0000 hourly 1 http://wordpress.org/?v=3.2.1 By: Brian O'Leary http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/comment-page-1/#comment-391 Brian O'Leary Tue, 17 Nov 2009 18:21:17 +0000 http://profilingguru.com/?p=429#comment-391 Tan, The method for attachment for flip chips is similar to that of BGAs. If you want to be absolutely certain of your joint reflow temperature you need to physically make contact thus drilling a hole. Currently RIT is conducting a very extensive study on "in-direct" methods of attachment, where one can use an off-set for example from thermocouples attached externally to the component. I've seen some of the preliminary data and it looks very promising, thought the study is focusing specifically on BGAs. The benefit of course is this is non destructive. This study should be completed by year end at which time I will be sure to post on this website as well. Brian Brian Tan,

The method for attachment for flip chips is similar to that of BGAs. If you want to be absolutely certain of your joint reflow temperature you need to physically make contact thus drilling a hole. Currently RIT is conducting a very extensive study on “in-direct” methods of attachment, where one can use an off-set for example from thermocouples attached externally to the component. I’ve seen some of the preliminary data and it looks very promising, thought the study is focusing specifically on BGAs. The benefit of course is this is non destructive. This study should be completed by year end at which time I will be sure to post on this website as well.

Brian

Brian

]]> By: Tan HH http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/comment-page-1/#comment-375 Tan HH Tue, 03 Nov 2009 02:25:15 +0000 http://profilingguru.com/?p=429#comment-375 Do you have any information on where to attach thermocouples on Flip chip packages bonded on substrate? From various website, the answer is to drill a hole through the substrate which is a challenge. Any other solution eg attaching the thermocouple on the die surface, substrate surface and etc would be a closer option? Do you have any information on where to attach thermocouples on Flip chip packages bonded on substrate? From various website, the answer is to drill a hole through the substrate which is a challenge. Any other solution eg attaching the thermocouple on the die surface, substrate surface and etc would be a closer option?

]]>