Reducing Reflow Product Changeover Time
Posted by Brian O'Leary on November 7, 2009 · Leave a Comment
2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another. If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!
To view the complete video series (click here).
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| Download (Duration: 3:40 — 16.9MB)
Filed under Improve, Podcasts, Process Window, Reflow · Tagged with AOI, BGA, BGA Profiling, ceramic packages, cost-based tools, electronics manufacturing services, energy efficiency, flip chip, maximize throughput, Process monitoring, Process Window, profiling, profiling software, Reflow, reflow oven, reflow ovens, reflow process, reflow profiling, SMT, SMT and standards, SMT Reflow, soldering, SPI, surface mount technology, Thermal Management, thermal process, thermal profiling, thermocouple attachment
About Brian O'Leary
Post Author: Brian O'Leary - Americas Sales Manager for KIC
