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	<title>&#187; BGA</title>
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	<link>http://profilingguru.com</link>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>&#187; BGA</title>
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		<link>http://profilingguru.com</link>
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	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
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	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Wed, 23 Nov 2011 11:11:30 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Reducing Reflow Product Changeover Time</title>
		<link>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/</link>
		<comments>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/#comments</comments>
		<pubDate>Sat, 07 Nov 2009 23:06:48 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=931</guid>
		<description><![CDATA[2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! To view the complete video series (click here). To subscribe to my [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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			<itunes:keywords>AOI,BGA,BGA Profiling,ceramic packages,cost-based tools,electronics manufacturing services,energy efficiency,flip chip,maximize throughput,Process monitoring,Process Window,profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! - </itunes:subtitle>
		<itunes:summary>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:40</itunes:duration>
	</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem: Title: Issues with BGA Components Near PCB Edges What issues are we likely to see when we place BGA components very close to [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Thermocouple Attachment Results are in!</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/#comments</comments>
		<pubDate>Mon, 12 Oct 2009 14:50:54 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=807</guid>
		<description><![CDATA[The Rochester Institute of Technology under the guidance of Dr. S. Manian Ramkumar Ph.D. just conducted (October 2009) the most comprehensive study to date on thermocouple attachment methods.  Part I of II was to determine the most accurate and reliable method of thermocouple attachment.  Part II that has yet to be released is to determine [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
		</item>
		<item>
		<title>Are you profiling bare boards or bricks?</title>
		<link>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/</link>
		<comments>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/#comments</comments>
		<pubDate>Sun, 11 Oct 2009 16:07:25 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=784</guid>
		<description><![CDATA[No one of course reflows bare boards, so why would you profile one?  For that same matter, no one sells bricks, so why do you put one through your reflow oven? Profiling Bare Boards: Today I came across CM doing exactly this.  They were processing networking boards.   They were  just too complex and expensive [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Why are you replacing BGAs?</title>
		<link>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/</link>
		<comments>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/#comments</comments>
		<pubDate>Fri, 02 Oct 2009 16:57:02 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=782</guid>
		<description><![CDATA[There is a great post today in Circuitnet titled &#8220;BGA Replacement Limits,&#8221; that can be found under Circuitmart.  Panelists answer the following question: How many times can a BGA component be replaced at the same location on the same PCB and retain reliability? Mark McMeen of STI Electronics suggests that the answer may be as [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>SMT related Links to know</title>
		<link>http://profilingguru.com/links/smt-related-links-to-know/</link>
		<comments>http://profilingguru.com/links/smt-related-links-to-know/#comments</comments>
		<pubDate>Wed, 30 Sep 2009 16:30:40 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Links]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=776</guid>
		<description><![CDATA[RSS feeds, Tweets, blogs and newsletters, how do you keep up?   Well here is the latest on what&#8217;s available in the SMT industry.   I subscribe to all of these newsletters and regularly pick out areas of interest related to profiling for you.   I also comb the blogs though I only know of two, not including [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/links/smt-related-links-to-know/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Non Destructive BGA Profiling Test #1</title>
		<link>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/</link>
		<comments>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/#comments</comments>
		<pubDate>Tue, 01 Sep 2009 11:49:40 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=429</guid>
		<description><![CDATA[I am currently investigating a non destructive method of BGA profiling that is reliable.  Here are the results of my first test. Set Up: Four thermocouples are attached to the same BGA (TOP, SIDE, INSIDE and BOTTOM surface), as pictured below.  Conductive aluminium double sided tape is used along with Kapton.  A KIC Explorer is [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/non-destructive-bga-profiling/feed/</wfw:commentRss>
		<slash:comments>2</slash:comments>
		</item>
		<item>
		<title>Plugging the Hole in the SMT Reflow Inspection Process</title>
		<link>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/</link>
		<comments>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/#comments</comments>
		<pubDate>Thu, 20 Aug 2009 22:35:28 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=578</guid>
		<description><![CDATA[MB (Marybeth) Allen, General Manager of KIC Europe in an interview with Globalsmt.net makes a terrific case for RPI (Reflow Process Inspection). Here are some excerpts: Q. 2009 saw the introduction of your RPI In-Line Process Inspection System for SMT reflow ovens.  For manufacturers currently relying on AOI and X-Ray systems to carry out inspection [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>BGA Profiling Webinar Recording</title>
		<link>http://profilingguru.com/reflow/bga-profiling-webinar-recording/</link>
		<comments>http://profilingguru.com/reflow/bga-profiling-webinar-recording/#comments</comments>
		<pubDate>Fri, 31 Jul 2009 17:25:42 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=570</guid>
		<description><![CDATA[The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. To subscribe to my Podcast for iTunes (click here).]]></description>
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		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/BGA_Profiling_Webinar2.m4v" length="53171671" type="video/x-m4v" />
			<itunes:keywords>BGA,BGA Profiling,cost-based tools,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards</itunes:keywords>
		<itunes:subtitle>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:00</itunes:duration>
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