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	<title>&#187; defect rates</title>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
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	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
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		<title>&#187; defect rates</title>
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		<item>
		<title>Four Ways to Reduce your Reflow Oven&#8217;s Power Consumption</title>
		<link>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/</link>
		<comments>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/#comments</comments>
		<pubDate>Fri, 25 Sep 2009 16:22:33 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=715</guid>
		<description><![CDATA[What are you paying annually in electricity to run your reflow oven?  Not taking into account indirect costs, surcharges, taxes and added wear and tear of running your oven hotter and harder, you might be paying anywhere from $6-8K per line.   This number is based off a study conducted at Flextronics Poland, where they pay [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Save 15% in 15 minutes on your reflow&#8217;s energy consumption</title>
		<link>http://profilingguru.com/promo/save-15-in-15-minutes-on-your-reflows-energy-consumption/</link>
		<comments>http://profilingguru.com/promo/save-15-in-15-minutes-on-your-reflows-energy-consumption/#comments</comments>
		<pubDate>Mon, 21 Sep 2009 22:10:12 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Promo]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=708</guid>
		<description><![CDATA[Topic: 15% electricity savings in 15 minutes Date: Friday, September 25, 2009 Time: 1:00 pm, Pacific Daylight Time (GMT -07:00, San Francisco) Meeting Number: 336 789 255 Meeting Password: (This meeting does not require a password.) To join the online meeting 1. Go to https://kicthermal.webex.com/kicthermal/j.php?ED=107946437&#38;UID=1013415122 2. Enter your name and email address. 3. Enter the [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/promo/save-15-in-15-minutes-on-your-reflows-energy-consumption/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Plugging the Hole in the SMT Reflow Inspection Process</title>
		<link>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/</link>
		<comments>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/#comments</comments>
		<pubDate>Thu, 20 Aug 2009 22:35:28 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=578</guid>
		<description><![CDATA[MB (Marybeth) Allen, General Manager of KIC Europe in an interview with Globalsmt.net makes a terrific case for RPI (Reflow Process Inspection). Here are some excerpts: Q. 2009 saw the introduction of your RPI In-Line Process Inspection System for SMT reflow ovens.  For manufacturers currently relying on AOI and X-Ray systems to carry out inspection [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>BGA Profiling Webinar Recording</title>
		<link>http://profilingguru.com/reflow/bga-profiling-webinar-recording/</link>
		<comments>http://profilingguru.com/reflow/bga-profiling-webinar-recording/#comments</comments>
		<pubDate>Fri, 31 Jul 2009 17:25:42 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=570</guid>
		<description><![CDATA[The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/bga-profiling-webinar-recording/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/BGA_Profiling_Webinar2.m4v" length="53171671" type="video/x-m4v" />
			<itunes:keywords>BGA,BGA Profiling,cost-based tools,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards</itunes:keywords>
		<itunes:subtitle>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:00</itunes:duration>
	</item>
		<item>
		<title>Energy Consumption Reduction for Reflow &#124; Better Thermal Management</title>
		<link>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/</link>
		<comments>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 21:54:07 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=565</guid>
		<description><![CDATA[Is your reflow oven throwing money away with a poor thermal management? To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/IMPROVE_Energy_Consumption.m4v" length="6693420" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,defect rates,efficiency,electronics manufacturing services,energy efficiency,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards,soldering</itunes:keywords>
		<itunes:subtitle>Is your reflow oven throwing money away with a poor thermal management? - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>Is your reflow oven throwing money away with a poor thermal management?

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
	</item>
		<item>
		<title>Profiling BGA Webinar</title>
		<link>http://profilingguru.com/reflow/profiling-bga-webinar/</link>
		<comments>http://profilingguru.com/reflow/profiling-bga-webinar/#comments</comments>
		<pubDate>Wed, 24 Jun 2009 21:28:55 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[Thermal Process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=532</guid>
		<description><![CDATA[Profiling BGA Webinar Supplemental (July 1, 2009): Component Specific Specs We discussed the need to define BGA specs separate from other components that have different reflow requirements.   BGAs typically require more heat to reflow properly but typically there are many other &#8220;smaller&#8221; components that also populate a PCB that will overheat if you develop your [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/profiling-bga-webinar/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Profiling guidelines for reflow of solder bump flip chip attach to organic and/or ceramic packages</title>
		<link>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/</link>
		<comments>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/#comments</comments>
		<pubDate>Wed, 24 Jun 2009 21:07:39 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=528</guid>
		<description><![CDATA[This post is in response to a suggested topic on this blog.  The following answer was provided by Brian J. Toleno, Ph.D., Director Technical Service at Henkel: When profiling a flip-chip to an organic substrate you typically want the delta T across the component to be as low as possible in order to minimize stresses [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/profiling-guidelines-for-reflow-of-flip-chip-attach-to-organic-ceramic-packages/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>How to add a Component Specific spec to a Profile</title>
		<link>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/</link>
		<comments>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/#comments</comments>
		<pubDate>Sun, 14 Jun 2009 23:53:38 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=520</guid>
		<description><![CDATA[What do you do when you have temperature tolerant components on your PCB that require a different reflow profile? To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Component_Specific_Specs.m4v" length="10674214" type="video/x-m4v" />
			<itunes:keywords>AOI,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT and standards,soldering</itunes:keywords>
		<itunes:subtitle>What do you do when you have temperature tolerant components on your PCB that require a different reflow profile? - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>What do you do when you have temperature tolerant components on your PCB that require a different reflow profile?

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
	</item>
		<item>
		<title>What is Reflow Process Inspection?</title>
		<link>http://profilingguru.com/reflow/what-is-reflow-process-inspection/</link>
		<comments>http://profilingguru.com/reflow/what-is-reflow-process-inspection/#comments</comments>
		<pubDate>Mon, 01 Jun 2009 21:45:16 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=485</guid>
		<description><![CDATA[Reflow Process Inspection is catching on as the next advancement in-line inspection systems for SMT Reflow.   I have pulled together the various aspects of RPI to better explain how it works and what are its benefits. How does RPI fit into the inspection processes in the SMT factory? Unlike SPI and AOI that are defect [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-is-reflow-process-inspection/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Is there a standard calibration tool for the reflow process?</title>
		<link>http://profilingguru.com/reflow/standard-calibration-tool-for-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/standard-calibration-tool-for-reflow-process/#comments</comments>
		<pubDate>Thu, 28 May 2009 16:25:25 +0000</pubDate>
		<dc:creator>Brian O&#39;Leary</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=468</guid>
		<description><![CDATA[A question was posted on Circuitnet (May 18, 2009) asking if there is a standard test board that can be used for profiling/calibration of a reflow oven.   Answers were provided by profiling companies, oven and rework station manufacturers. The consensus from all groups was: There is no standard test board. There is no substitute to [...]]]></description>
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