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	<title>&#187; reflow process</title>
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	<link>http://profilingguru.com</link>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
	<image>
		<title>&#187; reflow process</title>
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		<link>http://profilingguru.com</link>
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	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
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	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Wed, 23 Nov 2011 11:11:30 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Stop Destroying PCBs in profiling your reflow process</title>
		<link>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/</link>
		<comments>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/#comments</comments>
		<pubDate>Fri, 22 Jan 2010 16:40:09 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[SMT]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=980</guid>
		<description><![CDATA[2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. To view the complete video series (click here). To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/stop-destroying-pcbs-in-profiling-your-reflow-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Stop_Destroying_PCBs.mp4" length="28174734" type="video/mp4" />
			<itunes:keywords>profiling,Reflow,reflow process,SMT</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process. - To view the complete video series (click here). - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTA Long Island on how to use software tools that avoid destroying your PCBs during the profiling process.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>4:00</itunes:duration>
	</item>
		<item>
		<title>Reducing Reflow Product Changeover Time</title>
		<link>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/</link>
		<comments>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/#comments</comments>
		<pubDate>Sat, 07 Nov 2009 23:06:48 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=931</guid>
		<description><![CDATA[2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! To view the complete video series (click here). To subscribe to my [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Product_Changeover.m4v" length="17698353" type="video/x-m4v" />
			<itunes:keywords>AOI,BGA,BGA Profiling,ceramic packages,cost-based tools,electronics manufacturing services,energy efficiency,flip chip,maximize throughput,Process monitoring,Process Window,profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! - </itunes:subtitle>
		<itunes:summary>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:40</itunes:duration>
	</item>
		<item>
		<title>Increasing Reflow Oven Throughput</title>
		<link>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/</link>
		<comments>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/#comments</comments>
		<pubDate>Fri, 06 Nov 2009 11:53:21 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=902</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less. To view the complete video series [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Increased_Throughput.m4v" length="14288595" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a parti...</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:00</itunes:duration>
	</item>
		<item>
		<title>Getting your Profiler Deeper within Specification</title>
		<link>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/</link>
		<comments>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/#comments</comments>
		<pubDate>Wed, 04 Nov 2009 17:22:36 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=865</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! To view the complete video series (click here). To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Deeper_in_Spec.m4v" length="41867739" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards,SMT Reflow</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! - To view the complete video series (click here). - </itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:10</itunes:duration>
	</item>
		<item>
		<title>What to do with Zig-Zagging TC Readings?</title>
		<link>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/</link>
		<comments>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 17:02:48 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=846</guid>
		<description><![CDATA[What&#8217;s wrong with this picture? Well if you have ever used Kapton tape to attach a thermocouple, you have certainly seen your share of profiles like this! So what, it is a perfectly good profile, right?  Yes, but no.  I had a customer who was using KIC&#8217;s Navigation (auto prediction) to help create a better [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem: Title: Issues with BGA Components Near PCB Edges What issues are we likely to see when we place BGA components very close to [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Are you profiling bare boards or bricks?</title>
		<link>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/</link>
		<comments>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/#comments</comments>
		<pubDate>Sun, 11 Oct 2009 16:07:25 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=784</guid>
		<description><![CDATA[No one of course reflows bare boards, so why would you profile one?  For that same matter, no one sells bricks, so why do you put one through your reflow oven? Profiling Bare Boards: Today I came across CM doing exactly this.  They were processing networking boards.   They were  just too complex and expensive [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Why are you replacing BGAs?</title>
		<link>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/</link>
		<comments>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/#comments</comments>
		<pubDate>Fri, 02 Oct 2009 16:57:02 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=782</guid>
		<description><![CDATA[There is a great post today in Circuitnet titled &#8220;BGA Replacement Limits,&#8221; that can be found under Circuitmart.  Panelists answer the following question: How many times can a BGA component be replaced at the same location on the same PCB and retain reliability? Mark McMeen of STI Electronics suggests that the answer may be as [...]]]></description>
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		<slash:comments>0</slash:comments>
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		<item>
		<title>SMT related Links to know</title>
		<link>http://profilingguru.com/links/smt-related-links-to-know/</link>
		<comments>http://profilingguru.com/links/smt-related-links-to-know/#comments</comments>
		<pubDate>Wed, 30 Sep 2009 16:30:40 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Links]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=776</guid>
		<description><![CDATA[RSS feeds, Tweets, blogs and newsletters, how do you keep up?   Well here is the latest on what&#8217;s available in the SMT industry.   I subscribe to all of these newsletters and regularly pick out areas of interest related to profiling for you.   I also comb the blogs though I only know of two, not including [...]]]></description>
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