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	<title>&#187; soldering</title>
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	<link>http://profilingguru.com</link>
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	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
	<image>
		<title>&#187; soldering</title>
		<url>http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg</url>
		<link>http://profilingguru.com</link>
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	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
	</itunes:category>
	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB</title>
		<link>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/</link>
		<comments>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/#comments</comments>
		<pubDate>Wed, 23 Nov 2011 11:11:30 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=952</guid>
		<description><![CDATA[Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/tips-on-cooking-both-a-perfect-thanksgiving-turkey-and-a-pcb/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Reducing Reflow Product Changeover Time</title>
		<link>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/</link>
		<comments>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/#comments</comments>
		<pubDate>Sat, 07 Nov 2009 23:06:48 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=931</guid>
		<description><![CDATA[2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! To view the complete video series (click here). To subscribe to my [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/reducing-reflow-product-changeover-time/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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			<itunes:keywords>AOI,BGA,BGA Profiling,ceramic packages,cost-based tools,electronics manufacturing services,energy efficiency,flip chip,maximize throughput,Process monitoring,Process Window,profiling</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!! - </itunes:subtitle>
		<itunes:summary>2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:40</itunes:duration>
	</item>
		<item>
		<title>Thermocouple Attachment Results are in!</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/#comments</comments>
		<pubDate>Mon, 12 Oct 2009 14:50:54 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=807</guid>
		<description><![CDATA[The Rochester Institute of Technology under the guidance of Dr. S. Manian Ramkumar Ph.D. just conducted (October 2009) the most comprehensive study to date on thermocouple attachment methods.  Part I of II was to determine the most accurate and reliable method of thermocouple attachment.  Part II that has yet to be released is to determine [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
		</item>
		<item>
		<title>SMT related Links to know</title>
		<link>http://profilingguru.com/links/smt-related-links-to-know/</link>
		<comments>http://profilingguru.com/links/smt-related-links-to-know/#comments</comments>
		<pubDate>Wed, 30 Sep 2009 16:30:40 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Links]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[ceramic packages]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[flip chip]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=776</guid>
		<description><![CDATA[RSS feeds, Tweets, blogs and newsletters, how do you keep up?   Well here is the latest on what&#8217;s available in the SMT industry.   I subscribe to all of these newsletters and regularly pick out areas of interest related to profiling for you.   I also comb the blogs though I only know of two, not including [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/links/smt-related-links-to-know/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Running lead free and eutectic PCBs simultaneously on the same reflow oven</title>
		<link>http://profilingguru.com/reflow/improve/running-lead-free-and-eutectic-pcbs-simultaneously-on-the-same-reflow-oven/</link>
		<comments>http://profilingguru.com/reflow/improve/running-lead-free-and-eutectic-pcbs-simultaneously-on-the-same-reflow-oven/#comments</comments>
		<pubDate>Thu, 17 Sep 2009 15:29:29 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=699</guid>
		<description><![CDATA[Surface Mount Technology ran a piece titled Parallel Processes: Simultaneous Lead and Lead-free Soldering with a Single Reflow System written by Hans Bell of Rehm Thermal Systems GmbH.  Hans details a study where by controlling conveyor speed of each lane of a dual-lane system, it is possible to run both a lead and lead free [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/improve/running-lead-free-and-eutectic-pcbs-simultaneously-on-the-same-reflow-oven/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Plugging the Hole in the SMT Reflow Inspection Process</title>
		<link>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/</link>
		<comments>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/#comments</comments>
		<pubDate>Thu, 20 Aug 2009 22:35:28 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=578</guid>
		<description><![CDATA[MB (Marybeth) Allen, General Manager of KIC Europe in an interview with Globalsmt.net makes a terrific case for RPI (Reflow Process Inspection). Here are some excerpts: Q. 2009 saw the introduction of your RPI In-Line Process Inspection System for SMT reflow ovens.  For manufacturers currently relying on AOI and X-Ray systems to carry out inspection [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/plugging-the-hole-in-the-smt-reflow-inspection-process/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>BGA Profiling Webinar Recording</title>
		<link>http://profilingguru.com/reflow/bga-profiling-webinar-recording/</link>
		<comments>http://profilingguru.com/reflow/bga-profiling-webinar-recording/#comments</comments>
		<pubDate>Fri, 31 Jul 2009 17:25:42 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=570</guid>
		<description><![CDATA[The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/bga-profiling-webinar-recording/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/BGA_Profiling_Webinar2.m4v" length="53171671" type="video/x-m4v" />
			<itunes:keywords>BGA,BGA Profiling,cost-based tools,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards</itunes:keywords>
		<itunes:subtitle>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created. - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:00</itunes:duration>
	</item>
		<item>
		<title>Energy Consumption Reduction for Reflow &#124; Better Thermal Management</title>
		<link>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/</link>
		<comments>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 21:54:07 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=565</guid>
		<description><![CDATA[Is your reflow oven throwing money away with a poor thermal management? To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/energy-consumption-reduction-for-reflow-better-thermal-management/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/IMPROVE_Energy_Consumption.m4v" length="6693420" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,defect rates,efficiency,electronics manufacturing services,energy efficiency,profiling,Reflow,reflow oven,reflow process,reflow profiling,SMT and standards,soldering</itunes:keywords>
		<itunes:subtitle>Is your reflow oven throwing money away with a poor thermal management? - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>Is your reflow oven throwing money away with a poor thermal management?

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
	</item>
		<item>
		<title>How to Maximize Reflow Ovens Throughput</title>
		<link>http://profilingguru.com/reflow/maximize-reflow-ovens-throughput/</link>
		<comments>http://profilingguru.com/reflow/maximize-reflow-ovens-throughput/#comments</comments>
		<pubDate>Tue, 21 Jul 2009 21:09:19 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[maximize throughput]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=555</guid>
		<description><![CDATA[The following video shows you how to in the fewest steps possible in the least amount of time increase your reflow ovens throughput while maintaining an in-spec process.   In this real life example, throughput was increased by 20% in 20 minutes time!]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/maximize-reflow-ovens-throughput/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>How to add a Component Specific spec to a Profile</title>
		<link>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/</link>
		<comments>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/#comments</comments>
		<pubDate>Sun, 14 Jun 2009 23:53:38 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[AOI]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=520</guid>
		<description><![CDATA[What do you do when you have temperature tolerant components on your PCB that require a different reflow profile? To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/how-to-add-a-component-specific-to-a-profile/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Component_Specific_Specs.m4v" length="10674214" type="video/x-m4v" />
			<itunes:keywords>AOI,defect rates,efficiency,electronics manufacturing services,profiling,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT and standards,soldering</itunes:keywords>
		<itunes:subtitle>What do you do when you have temperature tolerant components on your PCB that require a different reflow profile? - To subscribe to my Podcast for iTunes (click here).</itunes:subtitle>
		<itunes:summary>What do you do when you have temperature tolerant components on your PCB that require a different reflow profile?

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
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