Tips on Cooking Both a Perfect Thanksgiving Turkey and a PCB

Why does it take half a day to cook a Thanksgiving turkey?  The answer is simple ― you have 20 lb of bird that simply cannot just be nuked in a microwave like last night’s dinner.  If not properly thawed, prepared and monitored, you either have an overcooked, dried-out bird or worse: Salmonella. Strangely enough, as you will see in a moment, PCBs are not that much different.

Let’s say you skip the thawing process and in your haste stick a frozen bird in the oven.  What happens?  The bird may look properly cooked on the outside, but as soon as you try your skill with the carving knife, you either hit bedrock or the inside is completely raw. OK, I will admit I speak from personal experience on this one (please do not bring this up with my wife).  Are PCBs any different?  Well, your reflow profile has a preheat phase, with the purpose of bringing your PCB to temperature. In other words, the entire mass of the board with all its components is gradually brought to equilibrium. If you do not do this, you run the risk of thermally shocking your components when they hit reflow and peak.  Thawing your bird and preheating your PCB ― you have the same objective in mind.

So, for the vast majority of us, we really have no idea when the turkey is fully cooked until getting an internal reading. A PCB is no different. On the surface, both might look great, but upon closer inspection, you discover some components have defects due to improper reflow or, for that matter, when you cut into a turkey that is still pink it really hits home that you aren’t cooking a TV dinner.


Because of this, as we all know, a 20 lb turkey requires a thermometer. I will concede that some of you use the old “poke the bird and check for pink until done” trick. Let’s assume you are not as skilled, like me, for example. Would you seriously cook a turkey by relying solely on the oven’s temperature reading on your stovetop?  Of course not, but why do some of you profile your PCB by relying on your reflow oven’s reported readings? Are either situation that much different?  Actually, yes. Your nice self-contained turkey cooking oven is more of a steady state, but there remains a large difference between what is reported by the oven and the internal temperature of your turkey. In contrast, your PCB is exposed to anything but a steady state environment because it rides on a conveyor through different heated zones with blowers, extraction systems and both ends of the oven even open to the elements!  For this reason, any oven manufacturer will adamantly tell you to profile and with regularity. Alright, you may have learned how to cook a turkey in your Mama’s kitchen and, in fact, be skilled at not using a thermometer; however, I doubt any serious SMT manufacturer would take a similar approach, checking your PCBs regularly for “doneness” in your reflow process.

What about placing the fate of your Thanksgiving feast on the cheap-o plastic pop-up indicator that likely came with the turkey? Do not laugh. How many of us use the trailing wires that came with the reflow oven?  Now to be fair, both work in principal; otherwise, you would have the likes of Purdue Farms with food poisoning lawsuits on their hands, but they only give you ballpark readings in many cases. By design, the turkey is going to be a little overdone and dried out.  Your PCB, on the other hand, cannot afford to be a little overdone or it is simply OUT of spec.  You can get by with eating the overcooked turkey … the gravy and mashed potatoes are there to make up for less than a perfectly cooked bird. But your PCB will not be as forgiving.  Trailing wires, never mind being cumbersome to use, have a tendency to kink and stretch, which compromise their readings.  They also are susceptible to 50 or 60 cycle noise from some reflow oven environments, further questioning their accuracy in some cases.

So you want to cook the perfect bird. Who doesn’t? So you pony up for a stainless steel large-dial meat thermometer to accurately read the internal temperature of your 20 lb bird. You also pony up for a KIC Explorer with Navigator because you want to create the perfect deep-in spec reflow profile. It will not only tell you the specific temperature of the joints of your $500 BGAs, but it also will find a balance that does not overcook them or any of your other temperature-sensitive components on the PCB.  No pop-up indicator profiler needs to apply since the KIC Explorer with Navigator will go the extra mile and tell you not only if you are in-spec but how DEEP in-spec your profile is, along with what can you do to improve the profile in minutes, if not seconds.  Now do you know of any turkey thermometers that can do that?

So when you prepare your Thanksgiving turkey, and as you pause to give thanks, consider applying the same care and consideration that you have given to your family’s feast as you do to your PCBs.

Happy Thanksgiving – Profilingguru


Reducing Reflow Product Changeover Time

2009 Presentation at SMT Long Island on how to reduce the changeover time from one reflow profile recipe to another.  If you ever opened up your reflow oven to dump all its heat to lessen downtime, this 4 min video is for you!!!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).


Are you profiling bare boards or bricks?

No one of course reflows bare boards, so why would you profile one?  For that same matter, no one sells bricks, so why do you put one through your reflow oven?

Profiling Bare Boards:

Today I came across CM doing exactly this.  They were processing networking boards.   They were  just too complex and expensive to profile, so the solution instead of finding a scrap board or some other reasonable substitute was to profile it as a bare board.  I guess the thinking was it is better than nothing, but can anyone honestly say that a bare board comes close to representing a true production board?  After all wouldn’t you agree profiling modern boards with mixed components, higher densities and micro-BGAs are already a challenge and to think profiling a bare board would yield any reliable results is a stretch?

Profiling Bricks:

So if this is such a terrible solution, what about putting a brick through your reflow oven?   A brick, come on Brian, who does this?  Well what do you think you are doing when you take one of the many fixtures available on the market that are used for characterizing an oven and using it to profile?    I bet if you melted them down (with profiler included) they aren’t far off in mass from a brick.   Consider the following attributes of a large mass:

  1. A large mass will behave differently than a production board.
  2. A large mass acts like a heat sink and will cause the oven to react differently compared to when a production board is run through the reflow oven.
  3. A large mass will result in a change to airflow due to its larger size as compared to the production board.

Now notice I included the profiler as part of the mass.  Many fixtures further add mass by adding a two pound weight to the fixture!   Now don’t get me wrong, these fixture do give you a relative measurement from week to week or month to month as to changes in the oven, but they do not tell you if your product is in spec nor provide a thermal profile.   Changes in the oven do not neatly correlate to changes in one’s profile.  After all how can they?   Chaos theory came out of the field of thermal dynamics, nothing neat about it.  Just like a bare board is no substitute to a populated PCB, a brick is also no substitute.

Don’t take my word for it, hear it from the oven manufacturers themselves.

Here is a quote from Fred Dimock of BTU:

Oven manufacturers normally use custom designed test fixtures to simulate a board but their real purpose is to measure uniformity across the oven and confirm that the oven is working correctly.

….I have personally seen companies place unrealistic performance specifications on reflow oven testing with (fixtures) boards that have little to do with actual production needs. For example, we once were required to show that an oven could reproduce an inspect ramp soak spike profile on two 12 X 18 inch aluminum sheets that were 0.040 and 0.080 inches thick without changing any recipe parameters….

….From a surface mount manufacturing point of view – single board oven performance testing has little benefit. The real answers are to use actual boards with TCs placed on the critical components….

Both solutions profiling bare boards and bricks are inadequate.  Make matters worse if you do both such as I saw with this CM, the results are only compounded.  In other words, you are developing a profile based on an unpopulated board and afterwords taking measurements with a thermal mass that does not in anyway represent how your oven will in fact react to a production board.  This is classic garbage in, garbage out.autofocus

Now there are alternative solutions that don’t require the destruction of a production board in the process.   Many of the automated systems will create accurate virtual representations of production boards without the need to attach a single thermocouple.   There are also some brilliant software solutions that allow you to create accurate profiles without the need to run a profile.


SMT related Links to know

RSS feeds, Tweets, blogs and newsletters, how do you keep up?   Well here is the latest on what’s available in the SMT industry.   I subscribe to all of these newsletters and regularly pick out areas of interest related to profiling for you.   I also comb the blogs though I only know of two, not including profilingguru, which is quite remarkable considering other industries have hundreds if not thousands.   The SMTA group forum on LinkedIn yields on occasion a nugget, but you need to build a profile to join.  SMTnet has always been a jewel.  Lastly, Twitter is a new phenomenon for many of us.   I am still trying to get the knack of it myself but it does have some value no doubt and will continue to grow.

On-line Newsletters:


Electronics Production World



PCB Update

SMT Week


Circuits Assembly


SMTA on LinkedIn



Circuit Assembly

Global SMT

SMT Magazine


Increasing Silicon Solar Efficiency Manufacturing

Global Solar Technology printed an article on Sept 16, 2009 highlighting an exciting ground breaking study that shows by optimizing the profile during the wafer firing process, a significant gain of .51% is achievable.  .51% is HUGE, which can easily translate into hundreds of thousands of dollars in increased revenues per solar manufacturing line.  That’s even in today’s depressed silicon market.

(Click here to view full article)

The thermal process of the wafer is one of the keys to achieving improved efficiencies. Drying steps are expected to remove most of the solvent used in the pastes before entering the firing zones. Solar cell metallization generally follows a spike profile type. Wafers only see peak temperature for approximately 1-4 seconds based on wafer and metallization chemistries. The most important steps include the clean burnout of the organics in the paste followed by etching through the silicon nitride (or other) passivation/ARC layer and, ultimately, the formation of good ohmic contact between the sintered silver and the very top layer of n-type silicon. These all lead to low contribution from series resistance and recombination resulting from the formation of the contacts. Control of this profile will become more crucial as the emitter depth decreases with increasing sheet resistance. Both uniformity of diffusion and furnace will be necessary to achieve the desired efficiency improvements.

The article walks you step by step through the study, here is an extend excerpt from the article related to profiling:

The base line profile on these wafers had been developed prior to the project based on extensive knowledge of the paste chemistry and years of practical experience with the metallization process. The base line profile can be seen in dark blue in Figure 1. For the base line test, as with all the subsequent process improvement tests, the wafers were processed at the same time and fired under the same conditions. Ten wafers were run through the furnace within a short period of time, and all were subjected to the same profile. After firing, we measured the cell efficiency in our continuous lamp tester. The average efficiency for the base line profile was 15.53 percent, as can be seen in Figure 2 (η Cell). Based on the type of wafer that was selected for this study, and the fact that a continuous lamp tester was used rather than a flash tester, this efficiency number was considered good. Now we wanted to make it better.


Figure 1: The wafer profiles for each group

It is important to acknowledge that what we were trying to accomplish was not to find a single “golden” profile for the wafers, but rather the optimal thermal process window. The Heraeus paste SOL9235H is a very robust paste that can perform well throughout a range of profiles. Establishing a thermal process window will set the upper and lower limits for the wafer’s peak temperature, time above certain temperature levels, etc. within which the cell efficiencies will be highest.

Figure 2: Cell efficieny testing

Figure 2: Cell efficieny testing

Figure 3: Boxplot of cell efficiencies for base wafer profile

Figure 3: Boxplot of cell efficiencies for base wafer profile

Since we did not yet know the upper and lower limits to our process window, we used the base line profile as a starting point, and we initially set relatively wide process limits around it as shown in Figure 4. The profiler software always measures how well the profile fits the chosen process window with a single number called Process Window Index (PWI). The PWI number is 100 percent when the profile is at the edge of the process window. The lower the number, the closer the profile is to the center of the process window. A PWI of 0 percent represents a profile at the very center of the process window.

Figure 4: Original Process Window

Figure 4: Original Process Window

Our KIC profiler also has profile simulation software that allowed us to change the furnace zone temperatures or conveyor speed in the software, and to immediately predict the resulting wafer profile. For the first process improvement step, we suspected that a higher peak temperature would benefit the metallization. We tried a few zone temperature changes in the software and studied the software simulation of the corresponding profile before settling on a 10°C increase in the furnace peak zones (Zone 5 and 6). Once the furnace stabilized on the new settings, we ran a set of 10 wafers for our Group 2 test. The average cell efficiency increased from 0.40 to 15.93 percent. For Group 3, we increased the peak temperatures settings in zones 5 and 6 another 10°C, but the average cell efficiency of the 10 wafers dropped by 0.12 percent.

For the Group 4 test, we set the zones back to the Group 2 level and reduced the furnace conveyor speed. The prediction software showed the impact on the wafer profile both in terms of peak temperature changes and, in particular, in terms of time above the various temperature levels shown in Figure 4. Due to this, we reduced the conveyor speed from 200 to 190″/min. The average cell efficiencies increased yet another 0.11 percent above the Group 2 numbers to a cell efficiency of 16.04 percent. Our final test for Group 5 kept the temperatures stable but increased the conveyor speed from 190 to 210″/min. That dropped the average cell efficiency by 0.16 percent.

Figure 5: e-Clispe TC attachment fixture

Figure 5: KIC's e-Clispe TC attachment fixture


By systematically changing certain key profile dimensions, such as peak temperature and time above 500°C, we were able to identify the “sweet spot” in the metallization process. The PWI index and the profiler’s simulation software allowed us to quickly identify the appropriate furnace settings for profiles below, above and in the middle of the optimal settings. This sweet spot yielded an average cell efficiency of 0.51 percent higher than previous experiments had allowed.

The Heraeus SOL 9235H silver paste’s properties allow for high-efficiency processing in a range of profiles, hence a process window can be established around the “ideal” profile identified above. Heraeus now advices its clients to the appropriate process window for each application.

With modern profilers, solar cell manufacturers can adjust their furnace setup until the wafer profile is positioned within the suggested process window. Over time, the thermal process will drift due to a number of variables such as heating lamps changing as they get older, wear and tear in the furnace, conveyor speed drifts, exhaust changes, and more. It then is a simple task for the manufacturing engineer to run another profile, and to use the profiler process optimization software to identify the furnace settings that will yield the appropriate profile.

This method for process optimization depends on accurate and repeatable profile readings. One excessive noise in the profile readings historically has been caused by the attachment method for the TCs. Both cemented and dummy wafer TCs tend to measure the material used to secure the TCs in place, rather than to measure the surface of the wafer. Pinning the TC to the wafer with a weight suffers from non-repeatability. The fixture with flattened TC beads has worked well for us.

Finally, process optimization must be quick and easy enough to be useful for volume production lines, as opposed to only the laboratory line. There is little use in perfecting the process in the laboratory just to see the transfer to the production lines fail because the furnace properties are different. Once the correct process window is established, the high-volume furnaces can be adjusted within minutes, keeping production downtime to a bare minimum. This task must not only be performed during transfer from the lab to the production line, but it also must be performed periodically due to the drift in the thermal process that is a fact of life in any production line. The few minutes it takes to adjust the production furnaces for peak performance is richly rewarded by the ability to consistently produce higher efficiency cells.

Future Studies

The temperature readings taken by the e-Clipse TC attachment fixture are higher than historic readings taken by older TC attachment methods. A future study will focus on quantifying the accuracy and repeatability of the new profiling method as it relates to the theoretical true wafer surface temperatures.

More information: Bjorn Dahle, president of KIC, +1-619-300-5586.


Plugging the Hole in the SMT Reflow Inspection Process

MB (Marybeth) Allen, General Manager of KIC Europe in an interview with makes a terrific case for RPI (Reflow Process Inspection). MB_Allen

Here are some excerpts:

Q. 2009 saw the introduction of your RPI In-Line Process Inspection System for SMT reflow ovens.  For manufacturers currently relying on AOI and X-Ray systems to carry out inspection functions, can you explain how this system works and why RPI should be the choice for this process?

Automated inspection systems have become critical in controlling quality throughout the manufacturing process.  SPI (solder paste inspection) and AOI (automated optical inspection) are excellent defect detection tools, within the limitations of their design.  The RPI (reflow process inspection) inspects the reflow process for each and every manufactured PCB.

The quality of a solder joint is not only a function of whether there was adequate solder, accuracy of placement, missing components etc., but that the solder was processed correctly.  For example, the peak temperature needs to be high enough, but not too high to damage the component; the time above liquidous must be within the required range etc.  The AOI machine is not designed to check for these critical events.

KIC’s RPI verifies that the PCBs have been manufactured within the required thermal process window.  Perhaps the best example of where RPI complements AOI is in the soldering of BGAs and other Area Array Packages, where the AOI machine cannot see the solder joints as they are hidden from view by the component body.  RPI even complements X-Ray machines as these inspection systems cannot tell whether the solder joints were processed in accordance with the required profile specs.

Q. So KIC RPI offers both oven and product data in one solution, this obviously enables the operator to harness this key data and use the yield charts to refine the process. What type of data do they receive and how easy is this to understand?

RPI automatically generates both Yield and DPMO (Defects Per Million Opportunities) production charts.  There’s really nothing for the customer to do as the information on all boards produced is captured automatically.  You’ve seen these charts in many factories showing product data for many steps in the manufacturing process.  However, previously data from the reflow process was missing.  Only reflow oven machine data was available.  KIC’s RPI now provides this missing key product process data, providing another key link to product quality.

Q. This product offers a timely solution for manufacturers in this tough climate and I understand it has already received awards for its innovation. What has been your feedback so far?

Yes, RPI has already received several awards around the world.    People are looking for a solution to save money and ensure continued quality control.  When I visit customers and prospective customers their initial questions or requests can be taken care of by using RPI.  It’s wonderful to be able to say “Yes, RPI can help you with that” to most of their requests.  We have plugged the hole in the inspection process.

For the full interview go to:


2009 EMAsia Innovation Award in the category of Process Control Software for its RPI in-line inspection system.

2009 NPI Award in the category of Process Control Tools for its RPI in-line inspection system.

Innovative Technology Center Award at Apex 2009



BGA Profiling Webinar Recording

The following presentation was first held as a 30 min BGA Profiling webinar in July 2009, with over 120 participants.  Due to its popularity an abridged 8 min version was created.

To subscribe to my Podcast for iTunes (click here).


Profiling BGA Webinar

Profiling BGA Webinar Supplemental (July 1, 2009):

Component Specific Specs

We discussed the need to define BGA specs separate from other components that have different reflow requirements.   BGAs typically require more heat to reflow properly but typically there are many other “smaller” components that also populate a PCB that will overheat if you develop your process solely around the BGA.   The following 2:40 min video reviews how you can bring both your BGAs and other temperature sensitive components into spec, striking a thermal balance that results in quality products.

Thermocouple Attachment

The following 1 min video shows one of the most reliable direct methods of TC attachment for BGA profiling.

…..but, who can always sacrifice a PCB in the process?   We talked about some indirect/non-destructive methods for profiling BGAs that are suggestive, but inconclusive.   In the fall I hope to have some results of a study that will help our industry come up with solutions that one can reasonably predict the temperature/profile of a BGA without destroying the PCB in the process or worse the BGA!

BGA Inspection

First there was SPI (solder paste inspection), then there was AOI, now there is RPI (Reflow Process Inspection)


You can see a prior blog posting discussing RPI at:

RPI works in the world of continuous reflow monitoring, where a profile is created for each and every production board.

In order to automate reflow profiling, a baseline/virtual profile is first established, where one runs a traditional profile with PCB, TC attachment and profiler while the on-board system of 30 thermocouples gathers the same profiling data and reconstructs and converts the traditional profile to a virtual representation. Once a virtual profile has been established, profiles can be collected for all production boards.  SPC charting, cPk, traceability and process control are all possible.

So rather then the reflow process being a black box, where anything and everthing can go wrong…..

illustration_5….alternatively, do you not only know what is going on continuously, but your BGAs using the techniques above are being monitored on a continuous basis.


Your Questions:

Q: Doesn’t the thermocouples utilized by the oven itself (assuming that they are calibrated and verified) provide the same basic information as the secondary set of TCs you are referring to?

ANSWER:  No, the oven thermocouples and the secondary KIC  TCs have completely different and separate functions.  The oven TCs are typically located close to the heaters since their job is to turn the heaters on and off as the temperature drifts from the set points.  The KIC 24/7 (or KIC Vision) TCs, located along the conveyor, help to automatically measure the profile that each PCB experiences as it is processed through the reflow oven or wave solder machine.  This function is called Virtual Profiling.

Virtual Profiling (VP) provides process traceability as it logs the profile for each PCB, along with information on how this profile fits the established process window.  The VP works in real time and offers instant alarm when the process (profile) drifts out of spec.   Because it provides basic SPC charting, it acts as an early warning system for trouble ahead.  Think of the KIC24/7 or KIC Vision as an automatic profiling system in real time.

Q:  I encountered wetting issue with CSP and BGA, how do I solve them?   /   Q: How about wetting issue?

Answer; In some cases, but of course not all cases, wetting issues are a result of incomplete flux activation in the solder paste and an overall low temp soak, where the components did not reach sufficient energy levels before entering the reflow, TAL stage of the process. Many of these issues are related to Pb – free solder pastes, mixed RoHS components or a number of other variables.

I suggest that the best answer is to research the publications available on the Web for the most relevant solution. The following is a link that closely resembles the issue, but again, you will need to research the most relevant to your situation.

Q:  How do you take measurements on each board without TCs?

Answer: KIC software algorithms compare what was observed at the time of the Baseline Profile to what is present within the oven during production. Using the 30 thermocouples in the oven, this data is communicated to the eTPU and the output is the PWI based on the specific process and the specification of that process.

Q:  How well does the DPMO relate to the actual defect where there could be placement defects interacting with reflow?

Answer: DPMO is a parameter of only the thermal reflow process. If issues exist in placement or screen printing, it will not be reflected in the DPMO, since KIC is only monitoring the thermal process. Given that all other aspects of the SMT line is functioning properly, DPMO will give an assessment of the thermal defects assuming that the proper solder paste and placement is present at the time the product enters the oven.

Q:  What about paste formulations?

Answer: KIC works with any solder paste manufactures to build the solder paste library that is present in the KIC software. This library is updated periodically and verified by the solder paste manufactures in most instances. The library however does not at any one time contain all information about all possible solder pastes. We try our best to be certain the information is present, but changes in formulation and engineering at the solder pate manufactures sometimes causes gaps that are beyond our control.

Q: How important is it to drill into the BGA ball and put the TC in it, vs. putting on the package, slip under the package, and on the bottom side of the board?

Answer: There are many variables in PCB design and component placement that directly and indirectly affect other components, in this case BGA. The best possible answer to this question is in the amount of data that is collected, how it is collected and how this information is applied to the specific PCB and BGA directly. Gathering as much information as possible, charting this info and drawing data driven values is the best possible formula for successful BGA reflow. Using all available data collection methods and positions aids in successfully reflowing this package.

As indicated during the webinar, we are currently commissioning a study to see if non destructive methods can be used in place of drill a hole.

Q: Does your software always choose an extended peak recipe?

Answer: No. Based on the type of recipe and profiles that are part of your normal production determines what path the KIC Navigator (auto-prediction) directs the profile. If your profiles are mainly RTP, the software looks at the values of the library data and suggests set points that will lead to a RTS profile. If your profiles are largely RSS, then the suggested set points will tend towards a RSS profile.


What is Reflow Process Inspection?

Reflow Process Inspection is catching on as the next advancement in-line inspection systems for SMT Reflow.   I have pulled together the various aspects of RPI to better explain how it works and what are its benefits.

How does RPI fit into the inspection processes in the SMT factory?

Unlike SPI and AOI that are defect inspection systems specifically designed for viewing solder deposition and component assembly respectively, RPI complements these systems by inspecting the performance of the thermal process IN-LINE.   RPI inspects the thermal process for any joint, including those that are not visible to the AOI system such as BGA components.

What is being measured?

RPI charts the thermal Process Yield and DPMO

What are the RPI benefits?

RPI provides information on the “health” of the thermal process over time.   The Yield and DPMO charts provide instant understanding of detrimental changes in the process.  The following format is easy to read and understand and often used by management as well as engineers.


For an Overview:


Awards for RPI:

2009 Innovation Award

KIC’s RPI Wins a 2009 NPI Award

Innovative Technology Center Award at Apex 2009


Is there a standard calibration tool for the reflow process?

A question was posted on Circuitnet (May 18, 2009) asking if there is a standard test board that can be used for profiling/calibration of a reflow oven.   Answers were provided by profiling companies, oven and rework station manufacturers.

The consensus from all groups was:

  • There is no standard test board.
  • There is no substitute to creating an actual profile of your product.

Here is a summary of panelist replies, including from yours truly (for a full transcript go to

Brian O’Leary – KIC  (full version)

The short answer to your question is no. There is no industry standard test board.

Test boards, also sometimes called “golden boards,” are an imperfect measure. Often, they are used for calibration purposes, but keep in mind every time you run the same PCB through an oven, some mass of the board is lost. For this reason, a true GOLD standard that is identical to your production board is difficult to achieve, unless you can somehow recreate the exact same conditions each and every time you profile your standard test board.

Since PCBs lose mass, some manufacturers will create calibration tools out of plates of stainless steal and use metal slugs to simulate components. Of course, a hunk of metal is no closer to a production board than a golden board, but at least it gives you a relative measure that is repeatable.

So what is the best answer if there is no perfect tool? There is no better representation of what is going on with your Reflow process than running an actual profile of a production board. The good news is that there are tools available that do not necessarily mean running a profile equals destruction of a sellable product nor does it mean that you need to waste the next few hours profiling.

Both oven manufacturers and profiling companies have developed onboard databases that allow you to develop in-spec profiles before you even profile (see this link) so when you run a verification profile you can at least do so knowing that the PCB being used can still be sold!

Another method of ensuring your process is continuously in spec and can serve as an early warning if things are going astray is the use of systems designed to monitor your oven.

For example, KIC’s 24-7 and Vision will create virtual representations of your PCB all based off of a true “golden board,” since the PCBs used to set up the system to create these virtual profiles are run through your process as actual profiles. As an added bonus, these same boards do not suffer from the repeated use problem described above with golden boards.

Fred Dimock – BTU

Oven manufacturers normally use custom designed test fixtures to simulate a board but their real purpose is to measure uniformity across the oven and confirm that the oven is working correctly. The test board might match a small percentage of boards actually being produced but is not close to many more and is not intended for calibration.

….I have personally seen companies place unrealistic performance specifications on reflow oven testing with boards that have little to do with actual production needs. For example, we once were required to show that an oven could reproduce an inspect ramp soak spike profile on two 12 X 18 inch aluminum sheets that were 0.040 and 0.080 inches thick without changing any recipe parameters….

….From a surface mount manufacturing point of view – single board oven performance testing has little benefit. The real answers are to use actual boards with TCs placed on the critical components….

Richard Burke – Datapaq

First of all, nothing can take the place of running profiles of your actual PCB’s…..

…There is really no industry standard test board available……to suggest otherwise would be dangerous whereas this would assume that all assemblies are identical and this is not the case. If you set the oven up to the test board, it would invariably be different than your own assemblies.   This is not a risk worth taking.

Al Cabral – VJ Technologies

Test boards can be created to illustrate specific characteristics of a reflow system, be it heating / cooling capacity, thermal repeatability, thermal uniformity across a conveyor system or designed to emulate a particular type of product.

It’s very difficult for one test vehicle to do it all well. A test board supplied by an oven manufacturer or independent supplier will likely address one or two of the aforementioned.

For example, a test vehicle designed to compare several ovens across multiple lines can be vastly different from a test vehicle designed to measure cross belt uniformity. Similarly, a test vehicle designed to gauge percent infrared, may not be well suited for CpK measurement.