<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	xmlns:itunes="http://www.itunes.com/dtds/podcast-1.0.dtd"
xmlns:rawvoice="http://www.rawvoice.com/rawvoiceRssModule/"
>

<channel>
	<title>&#187; thermal profile</title>
	<atom:link href="http://profilingguru.com/tag/thermal-profile/feed/" rel="self" type="application/rss+xml" />
	<link>http://profilingguru.com</link>
	<description></description>
	<lastBuildDate>Wed, 23 Nov 2011 17:36:54 +0000</lastBuildDate>
	<language>en</language>
	<sy:updatePeriod>hourly</sy:updatePeriod>
	<sy:updateFrequency>1</sy:updateFrequency>
	<generator>http://wordpress.org/?v=3.2.1</generator>
<!-- podcast_generator="Blubrry PowerPress/2.0.4" -->
	<itunes:summary>Profiling for Reflow Ovens made Simple.  Brought to you by the Profiling Gurus!</itunes:summary>
	<itunes:author>Brian O&#039;Leary</itunes:author>
	<itunes:explicit>clean</itunes:explicit>
	<itunes:image href="http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg" />
	<itunes:owner>
		<itunes:name>Brian O&#039;Leary</itunes:name>
		<itunes:email>boleary@kicmail.com</itunes:email>
	</itunes:owner>
	<managingEditor>boleary@kicmail.com (Brian O&#039;Leary)</managingEditor>
	<copyright>profilingguru 2009</copyright>
	<itunes:subtitle>Profiling for Reflow</itunes:subtitle>
	<itunes:keywords>profiling, profiler, reflow, reflow oven, thermal process, pwi, mole</itunes:keywords>
	<image>
		<title>&#187; thermal profile</title>
		<url>http://profilingguru.com/wp-content/uploads/2009/02/justguys-150x150.jpg</url>
		<link>http://profilingguru.com</link>
	</image>
	<itunes:category text="Technology">
		<itunes:category text="Software How-To" />
	</itunes:category>
	<itunes:category text="Education">
		<itunes:category text="Training" />
	</itunes:category>
		<item>
		<title>Increasing Reflow Oven Throughput</title>
		<link>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/</link>
		<comments>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/#comments</comments>
		<pubDate>Fri, 06 Nov 2009 11:53:21 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=902</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less. To view the complete video series [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/increasing-reflow-oven-throughput/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Increased_Throughput.m4v" length="14288595" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow oven,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a parti...</itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how to increase reflow oven throughput without sacrificing quality profiles in the process.  After you watch this 3 min video you will learn an easy method of increasing throughput on your reflow oven for a particular profile in 20 mins or less.

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>3:00</itunes:duration>
	</item>
		<item>
		<title>Getting your Profiler Deeper within Specification</title>
		<link>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/</link>
		<comments>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/#comments</comments>
		<pubDate>Wed, 04 Nov 2009 17:22:36 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Podcasts]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=865</guid>
		<description><![CDATA[2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! To view the complete video series (click here). To subscribe to my Podcast for iTunes (click here).]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/getting-your-profiler-deeper-within-specification/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
<enclosure url="http://profilingguru.com/podcasts/Deeper_in_Spec.m4v" length="41867739" type="video/x-m4v" />
			<itunes:keywords>cost-based tools,efficiency,electronics manufacturing services,profiling,profiling software,Reflow,reflow ovens,reflow process,reflow profiling,SMT,SMT and standards,SMT Reflow</itunes:keywords>
		<itunes:subtitle>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again! - To view the complete video series (click here). - </itunes:subtitle>
		<itunes:summary>2009 Presentation at SMTAI San Diego on how and why you need to drive your reflow profile deep within specification.  After you watch this 8 min video you will never take profiling for granted again!

To view the complete video series (click here).

To subscribe to my Podcast for iTunes (click here).</itunes:summary>
		<itunes:author>Brian O&#039;Leary</itunes:author>
		<itunes:explicit>clean</itunes:explicit>
		<itunes:duration>8:10</itunes:duration>
	</item>
		<item>
		<title>What to do with Zig-Zagging TC Readings?</title>
		<link>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/</link>
		<comments>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 17:02:48 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=846</guid>
		<description><![CDATA[What&#8217;s wrong with this picture? Well if you have ever used Kapton tape to attach a thermocouple, you have certainly seen your share of profiles like this! So what, it is a perfectly good profile, right?  Yes, but no.  I had a customer who was using KIC&#8217;s Navigation (auto prediction) to help create a better [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/what-to-do-with-zig-zagging-tc-readings/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Across the Belt Uniformity and Reflow Profiling</title>
		<link>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/</link>
		<comments>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/#comments</comments>
		<pubDate>Tue, 13 Oct 2009 16:00:13 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Define]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=823</guid>
		<description><![CDATA[I am often asked the question about how to handle components that are close to the outer edge of a PCB.   Today a question came in on Circuitnet to highlight this problem: Title: Issues with BGA Components Near PCB Edges What issues are we likely to see when we place BGA components very close to [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/across-the-belt-uniformity-and-reflow-profiling/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Thermocouple Attachment Results are in!</title>
		<link>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/</link>
		<comments>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/#comments</comments>
		<pubDate>Mon, 12 Oct 2009 14:50:54 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[soldering]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=807</guid>
		<description><![CDATA[The Rochester Institute of Technology under the guidance of Dr. S. Manian Ramkumar Ph.D. just conducted (October 2009) the most comprehensive study to date on thermocouple attachment methods.  Part I of II was to determine the most accurate and reliable method of thermocouple attachment.  Part II that has yet to be released is to determine [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/measure/thermocouple-attachment-results-are-in/feed/</wfw:commentRss>
		<slash:comments>4</slash:comments>
		</item>
		<item>
		<title>Are you profiling bare boards or bricks?</title>
		<link>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/</link>
		<comments>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/#comments</comments>
		<pubDate>Sun, 11 Oct 2009 16:07:25 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Automation]]></category>
		<category><![CDATA[Characterization]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[electronics manufacturing services]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[surface mount technology]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=784</guid>
		<description><![CDATA[No one of course reflows bare boards, so why would you profile one?  For that same matter, no one sells bricks, so why do you put one through your reflow oven? Profiling Bare Boards: Today I came across CM doing exactly this.  They were processing networking boards.   They were  just too complex and expensive [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/characterization/are-you-profiling-bare-boards-or-bricks/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Why are you replacing BGAs?</title>
		<link>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/</link>
		<comments>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/#comments</comments>
		<pubDate>Fri, 02 Oct 2009 16:57:02 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Define]]></category>
		<category><![CDATA[Measure]]></category>
		<category><![CDATA[TC's]]></category>
		<category><![CDATA[BGA]]></category>
		<category><![CDATA[BGA Profiling]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=782</guid>
		<description><![CDATA[There is a great post today in Circuitnet titled &#8220;BGA Replacement Limits,&#8221; that can be found under Circuitmart.  Panelists answer the following question: How many times can a BGA component be replaced at the same location on the same PCB and retain reliability? Mark McMeen of STI Electronics suggests that the answer may be as [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/define/why-are-you-replacing-bgas/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Solar Profiling explained at Hamburg Solar Energy Conference</title>
		<link>http://profilingguru.com/solar/solar-profiling-explained-at-hamburg-solar-energy-conference/</link>
		<comments>http://profilingguru.com/solar/solar-profiling-explained-at-hamburg-solar-energy-conference/#comments</comments>
		<pubDate>Tue, 29 Sep 2009 19:31:24 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Solar]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[Solar Cell Manufacturing]]></category>
		<category><![CDATA[Solar Cells]]></category>
		<category><![CDATA[Solar Efficiency]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thin fim solar cell manufacturing]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=771</guid>
		<description><![CDATA[MB (Marybeth) Allen is interviewed by Philip Stoten of PVP Now at the European Photovoltaic Solar Energy Conference and Exhibition in Hamburg, Germany. MB shows offs some of the features of the e-Clipse a new way to hold solar wafers without destroying them in the profiling process. Also MB discusses Spectrum, KIC&#8217;s optimization software that [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/solar/solar-profiling-explained-at-hamburg-solar-energy-conference/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Four Ways to Reduce your Reflow Oven&#8217;s Power Consumption</title>
		<link>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/</link>
		<comments>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/#comments</comments>
		<pubDate>Fri, 25 Sep 2009 16:22:33 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Featured]]></category>
		<category><![CDATA[Improve]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[cost-based tools]]></category>
		<category><![CDATA[defect rates]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[reflow oven]]></category>
		<category><![CDATA[reflow ovens]]></category>
		<category><![CDATA[reflow process]]></category>
		<category><![CDATA[reflow profiling]]></category>
		<category><![CDATA[SMT]]></category>
		<category><![CDATA[SMT and standards]]></category>
		<category><![CDATA[SMT Reflow]]></category>
		<category><![CDATA[Thermal Management]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=715</guid>
		<description><![CDATA[What are you paying annually in electricity to run your reflow oven?  Not taking into account indirect costs, surcharges, taxes and added wear and tear of running your oven hotter and harder, you might be paying anywhere from $6-8K per line.   This number is based off a study conducted at Flextronics Poland, where they pay [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/reflow/four-ways-to-reduce-your-reflow-ovens-power-consumption/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Increasing Silicon Solar Efficiency Manufacturing</title>
		<link>http://profilingguru.com/solar/increasing-silicon-solar-efficiency-manufacturing/</link>
		<comments>http://profilingguru.com/solar/increasing-silicon-solar-efficiency-manufacturing/#comments</comments>
		<pubDate>Thu, 24 Sep 2009 15:57:55 +0000</pubDate>
		<dc:creator>Bjorn Dahle</dc:creator>
				<category><![CDATA[Solar]]></category>
		<category><![CDATA[efficiency]]></category>
		<category><![CDATA[energy efficiency]]></category>
		<category><![CDATA[Process monitoring]]></category>
		<category><![CDATA[Process Window]]></category>
		<category><![CDATA[profiling]]></category>
		<category><![CDATA[profiling software]]></category>
		<category><![CDATA[Reflow]]></category>
		<category><![CDATA[Silicon Cell Manufacturing]]></category>
		<category><![CDATA[Solar Cell Manufacturing]]></category>
		<category><![CDATA[Solar Cells]]></category>
		<category><![CDATA[Solar Efficiency]]></category>
		<category><![CDATA[SPI]]></category>
		<category><![CDATA[thermal process]]></category>
		<category><![CDATA[thermal profile]]></category>
		<category><![CDATA[thermal profiling]]></category>
		<category><![CDATA[thermocouple attachment]]></category>
		<category><![CDATA[thin fim solar cell manufacturing]]></category>

		<guid isPermaLink="false">http://profilingguru.com/?p=726</guid>
		<description><![CDATA[Global Solar Technology printed an article on Sept 16, 2009 highlighting an exciting ground breaking study that shows by optimizing the profile during the wafer firing process, a significant gain of .51% is achievable.  .51% is HUGE, which can easily translate into hundreds of thousands of dollars in increased revenues per solar manufacturing line.  That&#8217;s [...]]]></description>
		<wfw:commentRss>http://profilingguru.com/solar/increasing-silicon-solar-efficiency-manufacturing/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
	</channel>
</rss>

