While most individuals understand that larger boards will require additional temperature in the oven recipe, several other parts play an equal, but less obvious part, in the reflow process. The number of components and materials used, including connective material all factor into the profile. While it takes more energy to raise a dense part one degree, it also takes more energy to preheat the surrounding area to a temperature that will allow the solder joint (the area of concern) to reach the desired temperature.
