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You are here: Home / Reflow / Types of Profiles / Low-Long –Spike

Low-Long –Spike

February 21, 2009 by Profiling Guru

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lsp-profile

Not a common profile, the LSP is intended to eliminate or reduce the occurrences of voiding. The slope is similar to the RSS profile but with the soak segment at a lower temperature and for a longer duration. It may be successfully used in an R&D environment.

I have used this profile when there is limited data on a product or on a first pass of a new product for which the process is not well understood. It is a good profile to use when characterizing a new process. The LSP profile will provide an indication of interaction amongst oven, PCB and components with the solder paste.

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Filed Under: Types of Profiles Tagged With: cost-based tools, defect rates, efficiency, electronics manufacturing services, profiling, Reflow, reflow profiling, SMT and standards, soldering, SPI, surface mount technology, thermal profiling

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